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FCU900N65S3Z

Onsemi

FCU900N65S3Z by Onsemi

FCU900N65S3Z by Onsemi is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. It features 4.5A Drain Current, 0.9 ohm On Resistance, and operates in ENHANCEMENT MODE. The transistor has a max power dissipation of 38W and can withstand temperatures from -55 to 150 °C.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 2,315 parts In-Stock

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Digiode

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Native Components

USA . 434 parts In-Stock

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$0.525

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Northwest PG Solutions

USA . 344 parts In-Stock

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Problanco Electronics

Mexico . 7,853 parts In-Stock

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TANS Electronics

Latvia . 7,678 parts In-Stock

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Kulean Microsystems

USA . 5,536 parts In-Stock

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Corphita

USA . 1,878 parts In-Stock

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SupplyDigital Components

Austria . 1,842 parts In-Stock

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Corohmni

South Africa . 485 parts In-Stock

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UHIMA Technologies

Türkiye . 94 parts In-Stock

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Overview

Enhance your electronics projects with the FCU900N65S3Z by Onsemi, a top-quality Power FET perfect for switching applications. Onsemi is a trusted manufacturer known for their reliable and innovative products. This N-CHANNEL transistor features a built-in diode and a high DS breakdown voltage of 650V, providing excellent performance and durability. With a maximum drain current of 4.5A and a low on-resistance of 0.9 ohm, this transistor offers exceptional value and efficiency. Upgrade your designs with the FCU900N65S3Z and experience the benefits of superior quality and performance in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good protection against environmental factors, ensuring the longevity and durability of the product.

Minimum DS Breakdown Voltage: 650 V

High breakdown voltage allows for reliable operation in high voltage applications, making it a suitable choice for power switching applications.

Maximum Power Dissipation (Abs): 38 W

High power dissipation capability ensures that the transistor can handle heavy loads without overheating, contributing to its reliability.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can withstand elevated temperatures, making it suitable for various industrial applications.

Maximum Drain-Source On Resistance: 0.9 ohm

Low on-resistance results in minimal power loss and efficient switching performance, making it a cost-effective and energy-efficient choice.

Technical Specifications

Power Field Effect Transistors (FET) FCU900N65S3Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

4.5 A

Maximum Drain Current (ID):

4.5 A

Maximum Drain-Source On Resistance:

.9 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251AA

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

11.3 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCU900N65S3Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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