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FCD340080Z

Onsemi

FCD340080Z by Onsemi

FCD340080Z by Onsemi is a N-CHANNEL Power FET with 800V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max Pulsed Drain Current of 4A and Avalanche Energy Rating of 12.8mJ. With a compact SMALL OUTLINE package style, it operates b/w -55 to 150 °C, making it suitable for high-power switching applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,653 parts In-Stock

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Vyrian

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TANS Electronics

Latvia . 6,306 parts In-Stock

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Kulean Microsystems

USA . 4,920 parts In-Stock

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Problanco Electronics

Mexico . 3,527 parts In-Stock

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SupplyDigital Components

Austria . 3,419 parts In-Stock

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Corphita

USA . 1,911 parts In-Stock

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Corohmni

South Africa . 447 parts In-Stock

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Native Components

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Northwest PG Solutions

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UHIMA Technologies

Türkiye . 140 parts In-Stock

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Overview

Unleash the power of innovation with the FCD340080Z by Onsemi - a top-of-the-line Power Field Effect Transistor designed for switching applications. Crafted with precision and expertise by Onsemi, a trusted manufacturer in the industry, this N-CHANNEL transistor offers unparalleled performance and reliability. With a high DS Breakdown Voltage of 800V and a compact small outline package, this transistor is a game-changer in the field. Experience seamless operation, enhanced efficiency, and superior quality with the FCD340080Z. Elevate your projects to new heights with this cutting-edge technology from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material that helps protect the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

Allows for efficient electron flow in the transistor, enabling fast switching capabilities.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenient design with a built-in diode for better current flow control and protection.

Transistor Application: SWITCHING

Specifically designed for switching applications, providing reliable performance in such scenarios.

Minimum DS Breakdown Voltage: 800 V

High breakdown voltage allows for usage in high voltage applications, ensuring safety and reliability.

Surface Mount: YES

Surface mount capability makes installation and soldering easier, saving time and effort.

Maximum Pulsed Drain Current (IDM): 4 A

High pulsed drain current allows for efficient power handling during peak load conditions.

Maximum Power Dissipation (Abs): 32 W

Ability to dissipate high power ensures stable operation under varying load conditions.

Maximum Operating Temperature: 150 °C

Wide operating temperature range allows for use in diverse environments without performance degradation.

Maximum Turn Off Time (toff): 93 ns

Fast turn off time ensures quick response and switching speed, ideal for time-sensitive applications.

Technical Specifications

Power Field Effect Transistors (FET) FCD340080Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

12.8 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

3.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.36 pF

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

4 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

93 ns

Maximum Turn On Time (ton):

53 ns

Trade Compliance

FCD340080Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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