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ESD7484NCTAG

Onsemi

ESD7484NCTAG by Onsemi

ESD7484NCTAG by Onsemi is a consumer IC with a rectangular package shape and 10 terminals. It features a grid array style with very thin profile and fine pitch, suitable for surface mount applications. With terminal finish of tin silver copper, it has a max seated height of 0.63mm and can withstand peak reflow temperature of 260 °C for up to 30s.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,271 parts In-Stock

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7,271

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Digiode

USA . 1,218 parts In-Stock

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1,218

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Distributors (Availability)

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Native Components

USA . 627 parts In-Stock

1+ parts

$0.560

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627

$0.560

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Northwest PG Solutions

USA . 850 parts In-Stock

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$0.616

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850

$0.616

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AZTECH Wire

Italy . 330 parts In-Stock

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$14.590

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330

$14.590

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Ampacity Inc.

Singapore . 1,630 parts In-Stock

1+ parts

$17.800

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1,630

$17.800

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Component Stockers USA

USA . 647 parts In-Stock

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$99.990

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647

$99.990

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Problanco Electronics

Mexico . 8,173 parts In-Stock

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8,173

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SupplyDigital Components

Austria . 7,359 parts In-Stock

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7,359

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A-Z Elektronik GmbH

Germany . 5,163 parts In-Stock

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5,163

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Alle Elektronik GmbH

Germany . 3,442 parts In-Stock

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3,442

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TANS Electronics

Latvia . 3,076 parts In-Stock

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3,076

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Kulean Microsystems

USA . 2,070 parts In-Stock

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Corphita

USA . 1,247 parts In-Stock

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Corohmni

South Africa . 117 parts In-Stock

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117

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UHIMA Technologies

Türkiye . 101 parts In-Stock

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101

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Perfect Parts

USA . 18 parts In-Stock

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18

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Overview

Enhance your electronic devices with the ESD7484NCTAG by Onsemi, a top-quality consumer IC that promises reliability and performance. Onsemi's reputation for excellence ensures that this product meets the highest standards in the industry. The ESD7484NCTAG is perfect for a wide range of applications, offering customers value and benefits like protection against electrostatic discharge and improved circuit performance. Upgrade your electronics with this cutting-edge solution from Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protection for the internal components of the IC, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape provides a standardized form factor that can easily fit into existing designs and layouts.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer electronic circuits, ensuring compatibility with a wide range of consumer devices.

No. of Terminals: 10

Sufficient number of terminals for connecting to external components and circuits, allowing for versatile functionality.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array style with thin profile and fine pitch enables high-density integration and precise connections, optimizing performance and efficiency.

Terminal Finish: TIN SILVER COPPER

TIN SILVER COPPER finish offers excellent conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, improving overall design flexibility and manufacturability.

Maximum Seated Height: 0.63 mm

Low seated height allows for compact designs and space-saving installations, especially in slim devices and applications with height constraints.

Width: 1.1 mm

Narrow width facilitates tight spacing and compact layouts, ideal for miniaturized electronics and products requiring efficient use of space.

Maximum Time At Peak Reflow Temperature (s): 30

Supports quick and efficient reflow soldering processes, reducing assembly time and ensuring reliable connections during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures proper soldering and bonding under elevated thermal conditions, enhancing overall product durability and stability.

Length: 1.6 mm

Compact length contributes to space-saving designs and enables the IC to be integrated into small form factor devices without compromising performance.

Terminal Form: BALL

Ball terminal form simplifies soldering and mounting processes, ensuring secure and reliable connections for improved overall product performance and longevity.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting, precise connections, and efficient signal routing, making it suitable for modern electronics demanding compact and reliable IC integration.

Technical Specifications

Other Function Consumer ICs ESD7484NCTAG attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B10

JESD-609 Code:

e1

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.63 mm

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.1 mm

Trade Compliance

ESD7484NCTAG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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