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ESD7484

Onsemi

ESD7484 by Onsemi

ESD7484 by Onsemi is a consumer IC with a rectangular package shape and 10 terminals. It features a very thin profile, fine pitch grid array style with 0.4mm terminal pitch. This IC is suitable for applications requiring surface mount technology in plastic/epoxy material packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,487 parts In-Stock

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2,487

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Vyrian

USA . 440 parts In-Stock

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440

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A&K Electronics

USA . 160 parts In-Stock

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160

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Bristol Electronics

USA . 160 parts In-Stock

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160

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 7,840 parts In-Stock

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7,840

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SupplyDigital Components

Austria . 7,750 parts In-Stock

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7,750

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TANS Electronics

Latvia . 5,867 parts In-Stock

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5,867

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Problanco Electronics

Mexico . 2,397 parts In-Stock

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2,397

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Corphita

USA . 2,051 parts In-Stock

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2,051

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Northwest PG Solutions

USA . 1,339 parts In-Stock

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1,339

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Native Components

USA . 890 parts In-Stock

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890

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UHIMA Technologies

Türkiye . 865 parts In-Stock

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865

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Corohmni

South Africa . 483 parts In-Stock

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483

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Overview

Enhance your electronic devices with the ESD7484 by Onsemi, a top-of-the-line consumer IC that guarantees quality and reliability. Manufactured by Onsemi, a trusted name in the industry, this product is designed to provide optimal performance in a variety of applications. With its advanced features and durable construction, the ESD7484 offers unparalleled value and benefits to customers looking for a high-quality solution to their electronic needs. Experience the advantages of this cutting-edge technology and take your devices to the next level today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the integrated circuits within the package.

Surface Mount: YES

Surface mounting allows for easy and efficient installation onto circuit boards.

Package Shape: RECTANGULAR

The rectangular shape is commonly used and compatible with various electronic devices.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, making it suitable for a wide range of devices such as smartphones, tablets, and home appliances.

No. of Terminals: 10

Provides multiple connection points for interfacing with other components in the circuit.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array layout with a thin profile and fine pitch allows for high-density mounting on circuit boards.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easier soldering and connection to the circuit board.

Maximum Seated Height: 0.63 mm

Low profile design enables compact and space-saving integration within electronic devices.

Width: 1.1 mm

Narrow width contributes to the miniaturization of the overall product design.

Length: 1.6 mm

Compact length further supports space-efficient mounting on the circuit board.

Terminal Form: BALL

Ball terminals provide reliable electrical connections and are ideal for surface mount applications.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting and enhances overall circuit performance.

Technical Specifications

Other Function Consumer ICs ESD7484 attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B10

Length:

1.6 mm

No. of Functions:

1

No. of Terminals:

10

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.63 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.1 mm

Trade Compliance

ESD7484 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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