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EMI8032MUTAG

Onsemi

EMI8032MUTAG by Onsemi

EMI8032MUTAG by Onsemi is a DATA LINE FILTER with 6 terminals, rated at 0.1A. It has an output impedance of 50 OHM and operates b/w -40 to 85 °C. This filter is used for IEC61000-4-2 approved applications requiring surface mount installation.

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Digiode

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Native Components

USA . 539 parts In-Stock

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SupplyDigital Components

Austria . 7,239 parts In-Stock

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TANS Electronics

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Problanco Electronics

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Corphita

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Northwest PG Solutions

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Kulean Microsystems

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Corohmni

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UHIMA Technologies

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Overview

Enhance the performance and reliability of your electronic devices with the EMI8032MUTAG data line filter by Onsemi. With a reputation for excellence in manufacturing, Onsemi brings you a top-quality product that meets IEC61000-4-2 approvals. This filter, designed with 6 terminals and a compact size, is ideal for a wide range of applications. Enjoy peace of mind knowing that your equipment is protected from electromagnetic interference, while benefiting from the superior value and efficiency that Onsemi products offer. Upgrade your electronics today with the EMI8032MUTAG and experience the difference.

Feature Benefit Bullets

Approvals (V) IEC61000-4-2

Ensures that the product meets international standards for Electrostatic Discharge (ESD) protection, providing reliability and safety in various environments.

No. of Terminals

With 6 terminals, this data line filter offers versatile connectivity options and compatibility with various data line configurations.

Filter Type

Being a data line filter, it helps to reduce electromagnetic interference and noise on data lines, improving signal quality and data transmission reliability.

Maximum Operating Temperature

With a high maximum operating temperature of 85 °C, this data line filter can withstand elevated temperatures, making it suitable for use in demanding applications.

Minimum Operating Temperature

The low minimum operating temperature of -40 °C ensures that the data line filter can function effectively even in cold environments, enhancing its versatility.

Width (mm)

With a slim width of 1.35mm, this data line filter is suitable for compact and space-constrained installations, offering flexibility in design.

Length

The short length of 1.5mm contributes to the compact size of the data line filter, making it easy to integrate into various devices and systems.

Output Impedance (ohm)

The 50 Ohm output impedance helps to match the filter to the impedance of the data lines, optimizing signal transfer and reducing signal reflections.

Packing Method

The Tape and Reel (TR) packing method provides convenience in handling, storage, and automated assembly processes, enhancing efficiency.

Mounting Type

With a surface mounting type, this data line filter can be easily mounted onto printed circuit boards, simplifying installation and ensuring secure attachment.

Rated Current

The 0.1A rated current capacity allows the data line filter to handle moderate current loads, ensuring reliability and performance in data transmission applications.

Height

The low height of 0.5mm contributes to the compact profile of the data line filter, making it suitable for slim and space-limited device designs.

Technical Specifications

Data Line Filters EMI8032MUTAG attributes and parameters. Explore more Data Line Filters devices from Onsemi

Specs

Approvals (V):

IEC61000-4-2

Filter Type:

Height:

.5 mm

Length:

1.5 mm

Mounting Type:

SURFACE MOUNT

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Impedance (ohm):

50 OHM

Packing Method:

TR

Rated Current:

Width (mm):

1.35

Trade Compliance

EMI8032MUTAG Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8504.50.80.00

SB

8504.50.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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