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E7160-0-102A57-BPG

Onsemi

E7160-0-102A57-BPG by Onsemi

E7160-0-102A57-BPG by Onsemi is a consumer circuit IC with 57 terminals in a rectangular package. It features a peak reflow temperature of 240 °C, 0.65mm terminal pitch, and 1.275mm max seated height. Ideal for applications requiring high-density mounting and compact design in consumer electronics.

Median Price

$232.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 19 parts In-Stock

1+ parts

$232.000

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19

$232.000

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Distributors (In-Stock)

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Digiode

USA . 2,174 parts In-Stock

1+ parts

$220.400

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2,174

$220.400

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Vyrian

USA . 6,682 parts In-Stock

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6,682

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Flip Electronics

USA . 30 parts In-Stock

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30

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 430 parts In-Stock

1+ parts

$0.049

100+ parts

-

1k+ parts

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10k+ parts

$0.047

430

$0.049

-

-

$0.047

Corphita

USA . 279 parts In-Stock

1+ parts

$208.800

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279

$208.800

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Corohmni

South Africa . 387 parts In-Stock

1+ parts

$232.000

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387

$232.000

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SupplyDigital Components

Austria . 7,906 parts In-Stock

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7,906

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TANS Electronics

Latvia . 7,321 parts In-Stock

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7,321

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Problanco Electronics

Mexico . 4,365 parts In-Stock

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4,365

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Kulean Microsystems

USA . 2,279 parts In-Stock

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2,279

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UHIMA Technologies

Türkiye . 624 parts In-Stock

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624

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Northwest PG Solutions

USA . 526 parts In-Stock

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526

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Perfect Parts

USA . 469 parts In-Stock

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469

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Authorized Procurement Solutions

USA . 146 parts In-Stock

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146

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Kepictronics

USA . 100 parts In-Stock

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100

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GreenTree Electronics

Israel . 100 parts In-Stock

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100

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Overview

Discover the innovative E7160-0-102A57-BPG by Onsemi, a top-quality consumer circuit IC that is sure to exceed your expectations. Manufactured by the trusted name in electronics, Onsemi, this product offers a range of applications in various industries. With its surface mount capabilities and compact package design, it provides convenience and ease of use for all your electronic needs. Experience the value and benefits of this versatile IC, designed to enhance your projects and deliver outstanding performance. Elevate your creations with the E7160-0-102A57-BPG and see the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the integrated circuits, ensuring a longer lifespan for the product.

Surface Mount: YES

Enables easy mounting on circuit boards, saving space and facilitating automated assembly processes.

No. of Terminals: 57

Allows for multiple connections and functionalities within the integrated circuit, expanding its capabilities.

Width: 3.94 mm

Compact size enables integration into smaller devices or circuit layouts, saving space and improving overall design efficiency.

Terminal Pitch: 0.65 mm

Close terminal pitch allows for high-density mounting and miniaturization of the circuit, enhancing performance and efficiency.

Moisture Sensitivity Level (MSL): 3

Indicates a moderate level of moisture sensitivity, suitable for a wide range of applications and environments.

Technical Specifications

Other Function Consumer ICs E7160-0-102A57-BPG attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B57

Length:

6.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

57

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA57,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

240

Maximum Seated Height:

1.275 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

3.94 mm

Trade Compliance

E7160-0-102A57-BPG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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