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E7160-0-102A57-AG

Onsemi

E7160-0-102A57-AG by Onsemi

E7160-0-102A57-AG by Onsemi is a consumer circuit IC with 57 terminals in a low profile, fine pitch grid array package. It operates b/w 0 to 50 °C and has a supply voltage range of 1.18V to 2V. Ideal for applications requiring compact design and high terminal count in consumer electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,841 parts In-Stock

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Digiode

USA . 1,167 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 650 parts In-Stock

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$0.730

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650

$0.730

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Northwest PG Solutions

USA . 1,483 parts In-Stock

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$0.803

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$0.803

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AZTECH Wire

Italy . 1,116 parts In-Stock

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$13.540

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Microchip USA

USA . 11,264 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 10,263 parts In-Stock

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Perfect Parts

USA . 8,960 parts In-Stock

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GreenTree Electronics

Israel . 7,250 parts In-Stock

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TANS Electronics

Latvia . 7,076 parts In-Stock

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SupplyDigital Components

Austria . 7,059 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Problanco Electronics

Mexico . 4,594 parts In-Stock

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Kulean Microsystems

USA . 1,655 parts In-Stock

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Corphita

USA . 363 parts In-Stock

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Corohmni

South Africa . 92 parts In-Stock

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UHIMA Technologies

Türkiye . 63 parts In-Stock

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Overview

Discover the innovative E7160-0-102A57-AG by Onsemi, a top-tier manufacturer known for their high-quality consumer ICs. This versatile product is perfect for a wide range of applications, offering customers unparalleled value and benefits. With its sleek rectangular package shape and surface mount capabilities, this consumer circuit boasts a low profile and fine pitch design. Trust Onsemi to deliver cutting-edge technology that exceeds expectations and enhances performance. Upgrade your electronics with the E7160-0-102A57-AG and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Ensures durability and protects the internal components of the IC.

Surface Mount: YES

Facilitates easy installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Fits well with standard circuit board designs and allows for efficient use of space.

Maximum Operating Temperature: 50 °C

Can withstand relatively high operating temperatures, making it suitable for various environments.

Minimum Operating Temperature: 0 °C

Operates effectively even in low-temperature conditions.

Width: 3.94 mm

Compact size allows for space-saving installation in tight electronic devices.

Minimum Supply Voltage (Vsup): 1.18 V

Operates at low voltage, conserving energy and reducing power consumption.

Peak Reflow Temperature °C: 240

Can withstand high reflow temperatures during manufacturing processes without damage.

Moisture Sensitivity Level (MSL): 3

Indicates that the IC is sensitive to moisture, so precautions need to be taken during handling and storage.

Maximum Supply Voltage (Vsup): 2 V

Supports a maximum supply voltage of 2V, providing flexibility in voltage requirements for the application.

Technical Specifications

Other Function Consumer ICs E7160-0-102A57-AG attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B57

Length:

6.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

57

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA57,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

240

Maximum Seated Height:

1.275 mm

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.18 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.94 mm

Trade Compliance

E7160-0-102A57-AG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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