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E7160-0P-102A57-AG

Onsemi

E7160-0P-102A57-AG by Onsemi

E7160-0P-102A57-AG by Onsemi is a consumer circuit IC with 57 terminals in a low profile, fine pitch grid array package. It operates b/w 0 to 50 °C and has a supply voltage range of 1.18V to 2V. Ideal for applications requiring compact design and high terminal count in consumer electronics.

Median Price

$54.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 500 parts In-Stock

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500

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Distributors (In-Stock)

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Bristol Electronics

USA . 185 parts In-Stock

1+ parts

$54.000

100+ parts

$45.360

1k+ parts

$43.740

10k+ parts

-

185

$54.000

$45.360

$43.740

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Vyrian

USA . 5,732 parts In-Stock

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5,732

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Digiode

USA . 1,666 parts In-Stock

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1,666

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Flip Electronics

USA . 500 parts In-Stock

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 865 parts In-Stock

1+ parts

$0.049

100+ parts

-

1k+ parts

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10k+ parts

$0.047

865

$0.049

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$0.047

Problanco Electronics

Mexico . 5,421 parts In-Stock

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5,421

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Kulean Microsystems

USA . 3,876 parts In-Stock

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3,876

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SupplyDigital Components

Austria . 2,885 parts In-Stock

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TANS Electronics

Latvia . 2,580 parts In-Stock

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2,580

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Northwest PG Solutions

USA . 1,376 parts In-Stock

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1,376

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Corohmni

South Africa . 400 parts In-Stock

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400

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Corphita

USA . 142 parts In-Stock

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142

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UHIMA Technologies

Türkiye . 75 parts In-Stock

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75

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Overview

Upgrade your electronics with the E7160-0P-102A57-AG by Onsemi, a top-quality consumer IC that offers unparalleled performance and reliability. Manufactured by industry leader Onsemi, this product is designed to meet the highest standards in the market. Ideal for a range of applications, this IC delivers exceptional value with its cutting-edge technology and innovative features. Trust Onsemi to provide you with the best in consumer circuits - experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the IC and ensures its durability.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and making manufacturing more efficient.

Package Shape: RECTANGULAR

Rectangular shape allows for easier placement and orientation on PCBs.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring compatibility and optimized performance.

No. of Terminals: 57

The high number of terminals allows for complex functionality and connectivity options.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers compact size and high density integration, ideal for space-constrained applications.

Maximum Operating Temperature: 50 °C

Ability to operate at high temperatures ensures reliable performance in a variety of environments.

Minimum Operating Temperature: 0 °C

Can operate in a wide range of temperatures, making it suitable for diverse applications.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easier PCB layout and assembly.

Maximum Seated Height: 1.275 mm

Low profile design allows for compact device construction and space-saving in tight designs.

Width: 3.94 mm

Narrow width makes it suitable for small form factor devices.

Minimum Supply Voltage (Vsup): 1.18 V

Low minimum supply voltage allows for energy-efficient operation.

Length: 6.8 mm

Compact length makes it suitable for applications with limited board space.

Temperature Grade: COMMERCIAL

Commercial grade ensures reliable performance for typical consumer electronics applications.

Terminal Form: BALL

Ball terminal form offers stable connection and easy soldering during assembly.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density integration on PCBs.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates that the IC is less sensitive to moisture during handling and storage.

Maximum Supply Voltage (Vsup): 2 V

Maximum supply voltage specification ensures safe operation within specified voltage limits.

Technical Specifications

Other Function Consumer ICs E7160-0P-102A57-AG attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B57

Length:

6.8 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

57

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA57,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.275 mm

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.18 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

3.94 mm

Trade Compliance

E7160-0P-102A57-AG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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