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DM2023-1HL3

Onsemi

DM2023-1HL3 by Onsemi

DM2023-1HL3 by Onsemi is a 2-row display with 20 characters per row, featuring a 5x8 Dot character font type. With a height of 32mm and depth of 13mm, it operates b/w temperatures of 0 to 50 °C. Ideal for applications requiring compact displays with clear visibility in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 575 parts In-Stock

1+ parts

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100+ parts

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575

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Vyrian

USA . 369 parts In-Stock

1+ parts

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1k+ parts

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10k+ parts

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369

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 145 parts In-Stock

1+ parts

$1.460

100+ parts

-

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145

$1.460

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Northwest PG Solutions

USA . 2,333 parts In-Stock

1+ parts

$1.606

100+ parts

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1k+ parts

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10k+ parts

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2,333

$1.606

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Kulean Microsystems

USA . 8,036 parts In-Stock

1+ parts

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8,036

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Problanco Electronics

Mexico . 2,748 parts In-Stock

1+ parts

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2,748

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SupplyDigital Components

Austria . 2,744 parts In-Stock

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2,744

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TANS Electronics

Latvia . 2,133 parts In-Stock

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2,133

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Corphita

USA . 500 parts In-Stock

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500

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UHIMA Technologies

Türkiye . 298 parts In-Stock

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298

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Corohmni

South Africa . 292 parts In-Stock

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292

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Overview

Elevate your display experience with the DM2023-1HL3 by Onsemi. Known for their superior quality and reliability, Onsemi displays are designed to meet the demands of various applications. Whether you're in need of a clear and concise display for industrial equipment or an informative monitor for consumer electronics, this product delivers exceptional value. With a sleek design and easy-to-read characters, the DM2023-1HL3 offers customers a user-friendly experience that will elevate any project. Choose Onsemi for top-of-the-line displays that exceed expectations.

Feature Benefit Bullets

Depth: 13 mm

Slim and compact design allows for easy installation in different applications without taking up too much space.

Rows Per Display: 2

Allows for displaying more information and data on the screen at the same time, increasing efficiency and productivity.

Maximum Operating Temperature: 50 °C

Can operate efficiently in higher temperature environments without any issues, providing reliability and durability.

Height: 32 mm

Ideal height for clear visibility and readability of displayed information, ensuring user-friendly experience.

Minimum Operating Temperature: 0 °C

Capable of functioning in colder temperatures without any compromises in performance, suitable for various environments.

Characters Per Row: 20

Allows for displaying detailed and descriptive information with longer texts on each row, enhancing communicative capabilities.

Nominal Supply Voltage: 5 V

Operates efficiently and effectively with standard voltage supply, ensuring compatibility with most systems.

Character Font Type: 5x8 Dot

Clear and crisp display of characters with defined dots, providing excellent readability and visual appeal.

Display Height: 4.85 mm

Optimal display height for showcasing content with good visibility and clarity, enhancing user experience.

Length: 116 mm

Compact size with sufficient length for accommodating necessary information, making it versatile in various applications.

Viewing Area Height: 16 mm

Adequate height for better viewing experience and readability of the displayed content, ensuring information is easily accessible.

Technical Specifications

Displays & Monitors DM2023-1HL3 attributes and parameters. Explore more Displays & Monitors devices from Onsemi

Specs

Character Font Type:

5x8 Dot

Characters Per Row:

20

Display Height:

4.85 mm

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

0 Cel

Depth:

13 mm

Height:

32 mm

Length:

116 mm

Rows Per Display:

2

Sub-Category:

Displays

Nominal Supply Voltage:

5 V

Viewing Area Height:

16 mm

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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