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CS5212GD14

Onsemi

CS5212GD14 by Onsemi

CS5212GD14 by Onsemi is a 14-terminal switching controller with max output current of 1.5A and max switching frequency of 900kHz. Ideal for applications requiring pulse width modulation control technique, such as small outline commercial-grade devices needing voltage-mode operation at temperatures ranging from 0 to 70 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,754 parts In-Stock

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1,754

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BCID Electronics Ltd.

Israel . 91 parts In-Stock

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Vyrian

USA . 91 parts In-Stock

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91

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Speed Components Ltd

Israel . 91 parts In-Stock

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91

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Distributors (Availability)

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Kulean Microsystems

USA . 7,714 parts In-Stock

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Problanco Electronics

Mexico . 5,525 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,411 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,607 parts In-Stock

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3,607

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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TANS Electronics

Latvia . 2,804 parts In-Stock

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Corphita

USA . 2,481 parts In-Stock

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SupplyDigital Components

Austria . 829 parts In-Stock

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UHIMA Technologies

Türkiye . 788 parts In-Stock

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Native Components

USA . 521 parts In-Stock

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$4.716

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521

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$4.716

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Corohmni

South Africa . 479 parts In-Stock

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479

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Northwest PG Solutions

USA . 247 parts In-Stock

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$4.765

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$4.765

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Overview

Discover the innovative CS5212GD14 by Onsemi, a cutting-edge switching regulator & controller designed to deliver superior performance and reliability. With Onsemi's renowned reputation for excellence in manufacturing, this product guarantees top-notch quality and durability. Ideal for a wide range of applications, this small outline package boasts 14 terminals and a maximum output current of 1.5A. Offering precise control and efficient operation, the CS5212GD14 ensures optimal performance at all times. Experience the value and benefits of this advanced technology, revolutionizing the way you power your devices.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for various applications.

Surface Mount : YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and facilitating mass production.

No. of Terminals : 14

The 14 terminals offer flexibility in connecting the regulator/controller to other components in the circuit, enabling versatile circuit design options.

Maximum Operating Temperature : 70 °C

With a maximum operating temperature of 70 °C, this product can withstand high heat conditions, enhancing its reliability in various environments.

Maximum Switching Frequency : 900 kHz

High switching frequency of 900 kHz ensures efficient operation and superior performance, making this product suitable for fast-paced applications.

Maximum Output Current : 1.5 A

A maximum output current of 1.5 A allows for powering of multiple components or devices, making this regulator/controller a versatile and powerful choice.

Technical Specifications

Switching Regulators & Controllers CS5212GD14 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT/VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

7 V

Minimum Input Voltage:

3.1 V

Nominal Input Voltage:

3.5 V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

1.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

900 kHz

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

CS5212GD14 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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