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CS5174GD8

Onsemi

CS5174GD8 by Onsemi

CS5174GD8 by Onsemi is a switching regulator with 2.4A output current and 620kHz max frequency. Ideal for boost applications, it operates b/w -40 to +125 °C, with input voltage range of 2.7V to 30V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,933 parts In-Stock

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Digiode

USA . 2,165 parts In-Stock

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AZTECH Wire

Italy . 869 parts In-Stock

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$17.820

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869

$17.820

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Native Components

USA . 831 parts In-Stock

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$28.794

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831

$28.794

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Northwest PG Solutions

USA . 525 parts In-Stock

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$31.673

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$28.506

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525

$31.673

$28.506

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Kulean Microsystems

USA . 6,809 parts In-Stock

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SupplyDigital Components

Austria . 6,402 parts In-Stock

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Problanco Electronics

Mexico . 2,118 parts In-Stock

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Corphita

USA . 1,607 parts In-Stock

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TANS Electronics

Latvia . 1,291 parts In-Stock

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Corohmni

South Africa . 381 parts In-Stock

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Microchip USA

USA . 252 parts In-Stock

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UHIMA Technologies

Türkiye . 7 parts In-Stock

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Overview

Experience superior performance and reliability with the CS5174GD8 by Onsemi, a top-of-the-line switching regulator designed to meet your power management needs. Onsemi's reputation for high-quality components shines through in this product, offering customers unparalleled value and benefits. From efficient control mode operation to a wide range of applications, this small outline package boasts a sleek design and impressive output current capabilities, making it the perfect choice for your next project. Elevate your power management solutions with the CS5174GD8 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and mechanical protection for the internal components of the regulator.

Surface Mount: YES

Allows for easy and efficient integration onto a PCB, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

Standard shape for easy mounting and handling during manufacturing.

No. of Terminals: 8

Provides ample connectivity options for various input and output configurations.

Maximum Operating Temperature: 125 °C

Ensures reliable operation even in high-temperature environments.

Control Mode: CURRENT-MODE

Offers precise control over the output current, improving efficiency and stability.

Nominal Input Voltage: 3.3 V

Ideal for applications requiring a stable input voltage of 3.3V.

Maximum Output Current: 2.4 A

Capable of delivering a high output current for power-hungry devices.

Technology: BIPOLAR

Provides robust performance and reliability in the switching regulator operation.

Control Technique: PULSE WIDTH MODULATION

Offers precise control over the output voltage by adjusting the duty cycle of the switching signal.

Switcher Config: BOOST

Boost topology allows for higher output voltage than the input voltage, suitable for voltage step-up applications.

Technical Specifications

Switching Regulators & Controllers CS5174GD8 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

30 V

Minimum Input Voltage:

2.7 V

Nominal Input Voltage:

3.3 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

2.4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BOOST

Maximum Switching Frequency:

620 kHz

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

CS5174GD8 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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