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CS51414GD8G

Onsemi

CS51414GD8G by Onsemi

CS51414GD8G by Onsemi is a switching regulator with 3A output current, 594kHz max switching frequency, and PWM control technique. It is used in applications requiring efficient voltage regulation in a compact form factor.

Median Price

$1.700

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$1.700

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150

$1.700

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Vyrian

USA . 5,827 parts In-Stock

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5,827

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Digiode

USA . 2,030 parts In-Stock

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2,030

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Prism Electronics

USA . 56 parts In-Stock

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56

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Distributors (Availability)

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Benley Electronics

USA . 59 parts In-Stock

1+ parts

$0.300

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59

$0.300

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Corohmni

South Africa . 382 parts In-Stock

1+ parts

$1.666

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382

$1.666

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Netroflash

USA . 50 parts In-Stock

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$1.700

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50

$1.700

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Ampacity Inc.

Singapore . 1,050 parts In-Stock

1+ parts

$4.500

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1,050

$4.500

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AZTECH Wire

Italy . 272 parts In-Stock

1+ parts

$10.906

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272

$10.906

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Component Stockers USA

USA . 673 parts In-Stock

1+ parts

$99.990

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673

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 9,781 parts In-Stock

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9,781

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Microchip USA

USA . 4,773 parts In-Stock

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4,773

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Kulean Microsystems

USA . 4,087 parts In-Stock

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4,087

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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3,700

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Problanco Electronics

Mexico . 3,090 parts In-Stock

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3,090

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Perfect Parts

USA . 2,579 parts In-Stock

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2,579

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Corphita

USA . 1,471 parts In-Stock

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1,471

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UHIMA Technologies

Türkiye . 666 parts In-Stock

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666

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SupplyDigital Components

Austria . 399 parts In-Stock

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399

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TANS Electronics

Latvia . 47 parts In-Stock

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47

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Overview

Unlock the power of efficient energy conversion with the CS51414GD8G by Onsemi. Designed with precision and reliability in mind, this switching regulator offers unparalleled performance in a compact package. Ideal for a wide range of applications, this product provides seamless control over current and voltage, ensuring optimal functionality in any situation. Say goodbye to wasted energy and hello to cost-effective solutions with the CS51414GD8G from Onsemi.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the components inside the regulator.

Surface Mount:

YES - Allows for easy installation and compatibility with modern PCB designs.

Package Shape:

RECTANGULAR - Space-efficient design for compact electronic devices.

No. of Terminals:

8 - Sufficient terminals for connecting various components in a circuit.

Package Style (Meter):

SMALL OUTLINE - Ideal for applications where space is limited.

Maximum Operating Temperature:

70 °C - Ensures reliable performance under normal operating conditions.

Control Mode:

CURRENT/VOLTAGE-MODE - Flexibility to adjust the regulation based on specific requirements.

Minimum Operating Temperature:

0 °C - Can operate in a wide range of temperatures.

Terminal Finish:

TIN - Provides good electrical conductivity for optimal performance.

Terminal Position:

DUAL - Convenient layout for easy connection to other components.

Maximum Seated Height:

1.75 mm - Low profile design for compact electronic devices.

Width (mm):

3.9 mm - Narrow width for space-saving installations.

Other IC type:

SWITCHING REGULATOR - Efficient and effective power management for electronic devices.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures reliability during reflow soldering processes.

Peak Reflow Temperature °C:

260 - Can withstand high-temperature soldering without damage.

Length:

4.9 mm - Compact size for integration into small electronic devices.

Temperature Grade:

COMMERCIAL - Suitable for standard commercial applications.

Maximum Switching Frequency:

594 kHz - Provides fast and efficient power regulation.

Maximum Output Current:

3 A - Capable of delivering enough power for various electronic components.

Terminal Form:

GULL WING - Reliable connection method for stable performance.

Control Technique:

PULSE WIDTH MODULATION - Precise control over the output voltage for consistent performance.

Switcher Config:

BUCK - Efficient step-down regulation for optimizing power consumption.

Terminal Pitch:

1.27 mm - Standard spacing for compatibility with common PCB layouts.

Minimum Input Voltage:

4.5 V - Can operate with low input voltages for versatility.

Maximum Input Voltage:

40 V - Compatible with a wide range of input voltages for flexibility in applications.

Technical Specifications

Switching Regulators & Controllers CS51414GD8G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

CURRENT

Other IC type:

Control Mode:

CURRENT/VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

40 V

Minimum Input Voltage:

4.5 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

594 kHz

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

CS51414GD8G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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