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CS51413GDR8G

Onsemi

CS51413GDR8G by Onsemi

CS51413GDR8G by Onsemi is a switching regulator with 3A output current, 594kHz max switching frequency, and PWM control technique. Ideal for applications requiring efficient voltage regulation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 9,938 parts In-Stock

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Vyrian

USA . 5,534 parts In-Stock

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Digiode

USA . 379 parts In-Stock

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379

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Distributors (Availability)

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Native Components

USA . 337 parts In-Stock

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$0.334

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$0.321

337

$0.334

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$0.321

Northwest PG Solutions

USA . 2,086 parts In-Stock

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$0.367

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$0.324

2,086

$0.367

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$0.324

AZTECH Wire

Italy . 823 parts In-Stock

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$15.070

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823

$15.070

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Problanco Electronics

Mexico . 6,932 parts In-Stock

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6,932

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Kulean Microsystems

USA . 6,613 parts In-Stock

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SupplyDigital Components

Austria . 6,134 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,093 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,062 parts In-Stock

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TANS Electronics

Latvia . 1,134 parts In-Stock

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Corphita

USA . 503 parts In-Stock

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Microchip USA

USA . 490 parts In-Stock

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490

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UHIMA Technologies

Türkiye . 321 parts In-Stock

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Corohmni

South Africa . 269 parts In-Stock

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Overview

Unleash the power of efficient energy management with the CS51413GDR8G by Onsemi. Manufactured by a trusted industry leader, this switching regulator offers unparalleled quality and reliability. Ideal for a wide range of applications, this compact and versatile product ensures optimal performance while reducing energy consumption. Experience enhanced control and efficiency with this innovative solution that delivers value and benefits to all customers. Choose the CS51413GDR8G for superior energy management and make a lasting impact on your operations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and resistant to external elements, ensuring durability and longevity.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the regulator to other components, allowing for diverse circuit configurations.

Maximum Output Current: 3 A

The high maximum output current of 3 A ensures that the regulator can power various devices and components with sufficient power delivery.

Maximum Switching Frequency: 594 kHz

The high maximum switching frequency allows for efficient and responsive voltage regulation, ensuring stable performance under varying load conditions.

Technical Specifications

Switching Regulators & Controllers CS51413GDR8G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

CURRENT

Other IC type:

Control Mode:

CURRENT/VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

40 V

Minimum Input Voltage:

4.5 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

594 kHz

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

CS51413GDR8G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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