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CS5124XDR8G

Onsemi

CS5124XDR8G by Onsemi

CS5124XDR8G by Onsemi is a switching controller with max output current of 1.5A and max switching frequency of 440kHz. Ideal for industrial applications, it operates b/w -40 to 105 °C, with input voltage range from 7.6V to 20V.

Median Price

$2.210

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 2,500 parts In-Stock

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Flip Electronics (Authorized)

USA . 2,040 parts In-Stock

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Vyrian

USA . 8,255 parts In-Stock

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PC Components Company LLC

USA . 2,500 parts In-Stock

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Bristol Electronics

USA . 2,500 parts In-Stock

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USA . 2,040 parts In-Stock

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Digiode

USA . 1,730 parts In-Stock

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Chip Stock

USA . 308 parts In-Stock

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Distributors (Availability)

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Benley Electronics

USA . 30 parts In-Stock

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$0.450

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30

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Native Components

USA . 485 parts In-Stock

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$2.144

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Corohmni

South Africa . 301 parts In-Stock

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$2.210

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Northwest PG Solutions

USA . 1,976 parts In-Stock

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$2.358

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AZTECH Wire

Italy . 191 parts In-Stock

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$10.740

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Perfect Parts

USA . 50,054 parts In-Stock

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Kulean Microsystems

USA . 5,769 parts In-Stock

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Kepictronics

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Microchip USA

USA . 4,282 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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iodParts Technologies Inc.

India . 2,500 parts In-Stock

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SupplyDigital Components

Austria . 1,260 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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TANS Electronics

Latvia . 972 parts In-Stock

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UHIMA Technologies

Türkiye . 696 parts In-Stock

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Problanco Electronics

Mexico . 569 parts In-Stock

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Corphita

USA . 285 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Onsemi with the CS5124XDR8G, a cutting-edge switching regulator & controller designed to meet your power management needs. With a versatile range of applications and advanced technology, this product offers customers unparalleled value and benefits. From its high efficiency to its innovative design, the CS5124XDR8G ensures optimal performance in industrial settings, making it the perfect choice for your power control solutions. Trust Onsemi to deliver excellence in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the switching regulator.

Surface Mount: YES

Being surface mountable enables ease of assembly and integration into a variety of electronic devices.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this switching regulator can operate efficiently even in harsh environmental conditions.

Control Mode: CURRENT-MODE

The current-mode control technique offers excellent load regulation and stability for the output voltage of the regulator.

Technology: BICMOS

Utilizing BiCMOS technology ensures high efficiency and fast switching speeds for improved performance of the regulator.

Maximum Output Current: 1.5 A

The high output current capability allows the regulator to power various electronic components and circuits with ease.

Minimum Input Voltage: 7.6 V

The low minimum input voltage requirement makes this switching regulator suitable for applications where a stable power supply is needed from lower input sources.

Technical Specifications

Switching Regulators & Controllers CS5124XDR8G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

20 V

Minimum Input Voltage:

7.6 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

440 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

CS5124XDR8G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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