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BS170RL1G

Onsemi

BS170RL1G by Onsemi

BS170RL1G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage. Ideal for SWITCHING applications, it has 0.5A Drain Current and 5 ohm On Resistance. Operating in ENHANCEMENT MODE, this transistor can handle up to 0.35W power dissipation at 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 10,973 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,000 parts In-Stock

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ComSIT USA

USA . 2,000 parts In-Stock

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Digiode

USA . 1,849 parts In-Stock

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Native Components

USA . 610 parts In-Stock

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$1.263

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Northwest PG Solutions

USA . 1,307 parts In-Stock

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$1.389

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AZTECH Wire

Italy . 1,005 parts In-Stock

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$13.240

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SupplyDigital Components

Austria . 6,248 parts In-Stock

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TANS Electronics

Latvia . 5,413 parts In-Stock

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Problanco Electronics

Mexico . 5,394 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Kulean Microsystems

USA . 3,617 parts In-Stock

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Corphita

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Kepictronics

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Corohmni

South Africa . 54 parts In-Stock

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UHIMA Technologies

Türkiye . 4 parts In-Stock

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Overview

Unlock the power of innovation with the BS170RL1G from Onsemi, a leader in semiconductor technology. This small signal field effect transistor offers unparalleled quality and reliability for switching applications. With a built-in diode and N-channel configuration, this transistor provides enhanced performance and efficiency. Whether you're designing electronics for automotive, industrial, or consumer applications, the BS170RL1G delivers exceptional value and benefits. Trust Onsemi to provide cutting-edge solutions that meet your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material results in a lightweight and durable transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher electron mobility and faster switching speeds, making them ideal for high frequency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient reverse current flow control, improving the overall performance of the transistor in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor provides fast and reliable switching between on and off states.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this transistor can handle higher voltages without breakdown, ensuring reliability in operation.

Package Shape: ROUND

The round package shape allows for easy mounting and installation, making it convenient for use in various circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering, enhancing the reliability and durability of the transistor in circuit applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control over the channel conductivity, enabling precise switching and improved efficiency in circuit operation.

Maximum Drain Current (Abs): 0.5 A

With a maximum drain current of 0.5A, this transistor can handle moderate current loads, making it suitable for small signal switching applications.

No. of Terminals: 3

Having three terminals allows for easy connectivity in circuits, providing flexibility in circuit design and implementation.

Maximum Power Dissipation (Abs): 0.35 W

The maximum power dissipation of 0.35W ensures that the transistor can operate within safe temperature limits, preventing overheating and damage.

Package Style (Meter): CYLINDRICAL

The cylindrical package style offers a compact and space-saving design, making it suitable for use in small electronic devices and tight spaces.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides efficient control over the flow of current, resulting in improved performance and reliability in circuit applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand high temperature environments, ensuring stable performance under varying conditions.

Transistor Element Material: SILICON

Silicon-based transistors offer high performance, durability, and reliability, making them a preferred choice for a wide range of electronic applications.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper terminal finish provides excellent solderability and corrosion resistance, ensuring long-term reliability and durability in circuit connections.

Maximum Drain-Source On Resistance: 5 ohm

With a maximum drain-source on resistance of 5 ohms, this transistor offers low power dissipation and efficient switching performance, suitable for various applications.

Terminal Position: BOTTOM

The bottom terminal position allows for easy mounting and soldering, ensuring secure connections and efficient heat dissipation in circuit applications.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C enables efficient soldering and assembly processes, ensuring reliable and robust connections in circuit applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) BS170RL1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

EUROPEAN PART NUMBER

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.5 A

Maximum Drain Current (ID):

.5 A

Maximum Drain-Source On Resistance:

5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-226AA

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BS170RL1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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