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7SB3257BMX1TCG

Onsemi

7SB3257BMX1TCG by Onsemi

7SB3257BMX1TCG by Onsemi is a single-ended multiplexer with 2 channels. It operates b/w -55 to 125 °C and has a max on-state resistance of 15 ohm. Suitable for military-grade applications due to its very thin profile, fine pitch package style.

Median Price

$0.147

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 144,000 parts In-Stock

1+ parts

-

100+ parts

$0.159

1k+ parts

$0.132

10k+ parts

$0.117

144,000

-

$0.159

$0.132

$0.117

DigiKey

USA . 144,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.140

144,000

-

-

-

$0.140

Verical

USA . 144,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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$0.147

144,000

-

-

-

$0.147

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 877 parts In-Stock

1+ parts

$0.113

100+ parts

-

1k+ parts

-

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877

$0.113

-

-

-

Digiode

USA . 1,712 parts In-Stock

1+ parts

$0.124

100+ parts

-

1k+ parts

-

10k+ parts

-

1,712

$0.124

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 109 parts In-Stock

1+ parts

$0.113

100+ parts

-

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-

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109

$0.113

-

-

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Corphita

USA . 933 parts In-Stock

1+ parts

$0.117

100+ parts

-

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933

$0.117

-

-

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Continental Prestige Electronics

USA . 144,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.117

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144,000

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-

$0.117

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Problanco Electronics

Mexico . 8,094 parts In-Stock

1+ parts

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8,094

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-

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Kulean Microsystems

USA . 7,337 parts In-Stock

1+ parts

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7,337

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SupplyDigital Components

Austria . 4,958 parts In-Stock

1+ parts

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4,958

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TANS Electronics

Latvia . 4,376 parts In-Stock

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4,376

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-

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Northwest PG Solutions

USA . 2,178 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$3.724

10k+ parts

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2,178

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-

$3.724

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Native Components

USA . 458 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$3.686

10k+ parts

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458

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$3.686

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UHIMA Technologies

Türkiye . 438 parts In-Stock

1+ parts

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438

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Microchip USA

USA . 341 parts In-Stock

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341

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Overview

Experience seamless performance and reliability with the 7SB3257BMX1TCG from Onsemi, a leading manufacturer in the industry. This multiplexer offers unparalleled precision and efficiency for a wide range of applications. With its surface mount capability and compact design, this product is perfect for military-grade operations. Trust in Onsemi's reputation for quality and innovation, and elevate your projects with the unmatched value and benefits that the 7SB3257BMX1TCG provides.

Feature Benefit Bullets

Surface Mount: YES

Convenience in installation and potentially cost-effective assembly process.

Nominal Supply Voltage (Vsup): 4.5 V

Optimal supply voltage for efficient operation and performance.

No. of Terminals: 6

Simplified connectivity for easier integration into circuits.

Maximum Operating Temperature: 125 °C

High tolerance to temperature variations for reliable operation in various environments.

Minimum Operating Temperature: -55 °C

Wide operating temperature range allows functionality in extreme conditions.

Maximum On-state Resistance (Ron): 15 ohm

Low resistance ensures minimal signal loss and high efficiency.

Maximum Switch-on Time: 4.6 ns

Fast switch-on time for quick response and seamless circuit switching.

Maximum Switch-off Time: 4.8 ns

Minimal switch-off time maintains signal integrity and reduces delays.

Temperature Grade: MILITARY

Meets high military standards for ruggedness and performance in demanding applications.

No. of Channels: 2

Multiple channels allow for versatile signal routing and switching options.

Technical Specifications

Multiplexers & Switches 7SB3257BMX1TCG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XBGA-B6

JESD-609 Code:

e4

Length:

1.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

6

Maximum On-state Resistance (Ron):

15 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Maximum Switch-off Time:

4.8 ns

Maximum Switch-on Time:

4.6 ns

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

BUTT

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1 mm

Trade Compliance

7SB3257BMX1TCG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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