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7SB3257MU3TCG

Onsemi

7SB3257MU3TCG by Onsemi

7SB3257MU3TCG by Onsemi is a dual-channel single-ended multiplexer with a max on-state resistance of 15 ohm. It operates b/w -55 to 125 °C and has a fast switch-on time of 4.6 ns. Ideal for military-grade applications requiring small outline, very thin profile packages in surface-mount configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

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1k+

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Digiode

USA . 947 parts In-Stock

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Kulean Microsystems

USA . 8,346 parts In-Stock

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Problanco Electronics

Mexico . 6,215 parts In-Stock

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TANS Electronics

Latvia . 6,103 parts In-Stock

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SupplyDigital Components

Austria . 3,559 parts In-Stock

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Corphita

USA . 881 parts In-Stock

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UHIMA Technologies

Türkiye . 821 parts In-Stock

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Native Components

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Northwest PG Solutions

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Corohmni

South Africa . 269 parts In-Stock

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Overview

Elevate your electronic designs with the 7SB3257MU3TCG by Onsemi, a top-tier manufacturer known for their superior quality and reliability. This multiplexer switch is a game-changer in the industry, offering unmatched performance and versatility. Ideal for a wide range of applications, this product delivers exceptional value and benefits to customers looking for seamless integration and enhanced functionality. Upgrade your projects with the best in the business and experience the difference with Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the product, making it suitable for various applications.

Surface Mount: YES

Being surface mountable ensures easy and convenient installation, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 4.5 V

Optimal supply voltage of 4.5 V ensures efficient performance and power consumption for the product.

No. of Terminals: 6

Having 6 terminals allows for versatile connectivity options, accommodating multiple inputs and outputs.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, the product can withstand extended use in various environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C ensures the product can operate in extreme cold conditions without issues.

No. of Channels: 2

Featuring 2 channels provides flexibility in routing and switching signals, making it suitable for dual-input applications.

Technical Specifications

Multiplexers & Switches 7SB3257MU3TCG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-PDSO-N6

Length:

1 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

6

Maximum On-state Resistance (Ron):

15 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Maximum Switch-off Time:

4.8 ns

Maximum Switch-on Time:

4.6 ns

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1 mm

Trade Compliance

7SB3257MU3TCG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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