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7SB3257MUTCG

Onsemi

7SB3257MUTCG by Onsemi

7SB3257MUTCG by Onsemi is a dual single-ended multiplexer with 2 channels. It operates b/w -55 to 125 °C, with Vsup ranging from 4-5.5V. Featuring a low Ron of 15 ohm, it has fast switch-on/off times of 4.6/4.8 ns, making it ideal for military-grade applications in small outline packages.

Median Price

$0.150

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 129,503 parts In-Stock

1+ parts

-

100+ parts

$0.153

1k+ parts

$0.127

10k+ parts

$0.113

129,503

-

$0.153

$0.127

$0.113

Verical

USA . 72,503 parts In-Stock

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-

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$0.148

72,503

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$0.148

Distributors (In-Stock)

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Digiode

USA . 2,409 parts In-Stock

1+ parts

$0.124

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2,409

$0.124

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Vyrian

USA . 4,454 parts In-Stock

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4,454

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Distributors (Availability)

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Corohmni

South Africa . 420 parts In-Stock

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$0.100

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420

$0.100

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Corphita

USA . 2,217 parts In-Stock

1+ parts

$0.118

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2,217

$0.118

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AZTECH Wire

Italy . 484 parts In-Stock

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$19.250

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484

$19.250

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Continental Prestige Electronics

USA . 129,503 parts In-Stock

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$0.158

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129,503

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$0.158

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SupplyDigital Components

Austria . 3,470 parts In-Stock

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3,470

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TANS Electronics

Latvia . 2,881 parts In-Stock

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Kulean Microsystems

USA . 2,661 parts In-Stock

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Problanco Electronics

Mexico . 1,163 parts In-Stock

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Northwest PG Solutions

USA . 1,038 parts In-Stock

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UHIMA Technologies

Türkiye . 656 parts In-Stock

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Microchip USA

USA . 420 parts In-Stock

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Native Components

USA . 219 parts In-Stock

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219

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Overview

Discover the innovative 7SB3257MUTCG by Onsemi, a top-of-the-line multiplexer that offers unmatched quality and reliability. With a focus on precision engineering, Onsemi delivers superior performance in a compact package. Ideal for military-grade applications, this versatile device boasts a fast switch-on time of 4.6 ns, ensuring seamless operation. Experience the benefits of a maximum on-state resistance of 15 ohms and a wide operating temperature range from -55 °C to 125°C. Elevate your projects with the exceptional value and efficiency of the 7SB3257MUTCG by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, reducing production time and costs.

Nominal Supply Voltage (Vsup): 4.5 V

Operating within a stable voltage range of 4.5V ensures consistent performance and reliability.

No. of Terminals: 6

Having 6 terminals provides flexibility in connecting various components or devices for multiplexing operations.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, the product can withstand elevated temperatures without compromising functionality.

Width (mm): 1 mm

The compact width of 1mm allows for efficient use of space on a circuit board, especially in densely packed electronic systems.

Minimum Supply Voltage (Vsup): 4 V

The ability to operate at a minimum voltage of 4V ensures compatibility with a wide range of systems and power sources.

Maximum On-state Resistance (Ron): 15 ohm

Low on-state resistance of 15 ohms minimizes signal loss and ensures efficient transmission of data across the channels.

Temperature Grade: MILITARY

Designed to meet military-grade standards, this product offers high performance and reliability in demanding environments.

No. of Channels: 2

The inclusion of 2 channels allows for simultaneous multiplexing of multiple signals, increasing operational efficiency.

Technical Specifications

Multiplexers & Switches 7SB3257MUTCG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

6

Maximum On-state Resistance (Ron):

15 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Maximum Switch-off Time:

4.8 ns

Maximum Switch-on Time:

4.6 ns

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1 mm

Trade Compliance

7SB3257MUTCG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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