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74LVC374ADTR2G

Onsemi

74LVC374ADTR2G by Onsemi

74LVC374ADTR2G by Onsemi is an 8-bit bus driver with a supply voltage of 3.3V, featuring a propagation delay of 18.8ns and operating temperature range from -40 to 125 °C. It is ideal for automotive applications requiring CMOS technology, offering dual terminal position and true output polarity in a small outline package.

Median Price

$0.127

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 39,983 parts In-Stock

1+ parts

-

100+ parts

$0.132

1k+ parts

$0.110

10k+ parts

$0.098

39,983

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$0.132

$0.110

$0.098

Verical

USA . 39,983 parts In-Stock

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-

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$0.122

39,983

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$0.122

Distributors (In-Stock)

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Digiode

USA . 1,430 parts In-Stock

1+ parts

$0.103

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1,430

$0.103

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Vyrian

USA . 8,097 parts In-Stock

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8,097

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Distributors (Availability)

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Corphita

USA . 2,350 parts In-Stock

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$0.097

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2,350

$0.097

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Corohmni

South Africa . 381 parts In-Stock

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$0.108

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381

$0.108

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AZTECH Wire

Italy . 599 parts In-Stock

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$18.930

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599

$18.930

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Native Components

USA . 797 parts In-Stock

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$109.978

100+ parts

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$105.578

797

$109.978

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$105.578

Northwest PG Solutions

USA . 1,535 parts In-Stock

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$120.975

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1,535

$120.975

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Continental Prestige Electronics

USA . 39,983 parts In-Stock

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$0.130

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Kulean Microsystems

USA . 6,094 parts In-Stock

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TANS Electronics

Latvia . 5,555 parts In-Stock

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Problanco Electronics

Mexico . 4,789 parts In-Stock

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SupplyDigital Components

Austria . 2,340 parts In-Stock

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2,340

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UHIMA Technologies

Türkiye . 900 parts In-Stock

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900

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Microchip USA

USA . 421 parts In-Stock

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Overview

Enhance your electronic designs with the reliable and high-quality 74LVC374ADTR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch bus driver & transceivers that offer seamless integration and superior performance. With a wide range of applications, this product provides value and benefits to customers looking for efficiency and reliability in their projects. Trust Onsemi for innovative solutions that elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product suitable for use in automotive applications where weight and reliability are important factors.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage level of 3.3V, ensuring compatibility with common power sources and reducing the need for additional voltage regulation circuits.

Propagation Delay (tpd): 18.8 ns

Low propagation delay ensures fast signal transmission, making the product ideal for applications requiring quick response times.

Temperature Grade: AUTOMOTIVE

Designed to operate in automotive temperature range (-40 °C to 125°C), ensuring reliable performance in harsh environmental conditions typically found in automotive applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product efficient and reliable in data transmission.

Technical Specifications

Bus Driver & Transceivers 74LVC374ADTR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

18.8 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74LVC374ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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