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74LVC240ADTR2G

Onsemi

74LVC240ADTR2G by Onsemi

74LVC240ADTR2G by Onsemi is a Bus Driver & Transceiver with 2 functions, 4 bits, and 3-STATE output. It operates at a nominal voltage of 3.3V with a propagation delay of 14.6ns. Ideal for automotive applications due to its CMOS technology and wide temperature range from -40 °C to 125°C.

Median Price

$0.127

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 48,000 parts In-Stock

1+ parts

-

100+ parts

$0.132

1k+ parts

$0.110

10k+ parts

$0.098

48,000

-

$0.132

$0.110

$0.098

Verical

USA . 48,000 parts In-Stock

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-

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$0.122

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$0.122

Distributors (In-Stock)

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Digiode

USA . 1,168 parts In-Stock

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$0.103

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1,168

$0.103

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Vyrian

USA . 2,059 parts In-Stock

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2,059

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Distributors (Availability)

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Corphita

USA . 221 parts In-Stock

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$0.097

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221

$0.097

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Component Stockers USA

USA . 36,255 parts In-Stock

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$0.110

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$0.100

1k+ parts

$0.090

10k+ parts

$0.090

36,255

$0.110

$0.100

$0.090

$0.090

Native Components

USA . 391 parts In-Stock

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$1.717

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391

$1.717

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Northwest PG Solutions

USA . 45 parts In-Stock

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$1.888

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45

$1.888

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AZTECH Wire

Italy . 329 parts In-Stock

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$22.160

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$22.160

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Corohmni

South Africa . 72 parts In-Stock

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$22.783

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Advanced Electronics

New Zealand . 24 parts In-Stock

1+ parts

$33.612

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$30.587

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$27.562

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24

$33.612

$30.587

$27.562

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Continental Prestige Electronics

USA . 48,000 parts In-Stock

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$0.130

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TANS Electronics

Latvia . 7,748 parts In-Stock

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SupplyDigital Components

Austria . 5,034 parts In-Stock

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Kulean Microsystems

USA . 3,640 parts In-Stock

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UHIMA Technologies

Türkiye . 678 parts In-Stock

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Microchip USA

USA . 336 parts In-Stock

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Problanco Electronics

Mexico . 92 parts In-Stock

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Overview

Enhance your electronic designs with the 74LVC240ADTR2G by Onsemi, a top-tier manufacturer known for producing high-quality bus drivers & transceivers. This compact component offers 3-STATE output characteristics and inverted output polarity, making it ideal for a variety of applications. With a wide temperature range and a minimal supply voltage of 1.65V, this product ensures reliable performance in automotive settings. Experience the value of seamless communication and efficient signal transmission with the 74LVC240ADTR2G - a game-changer for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the internal components of the bus driver and transceivers, making it suitable for various environments.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions in one component increases functionality and reduces the need for additional components, ultimately simplifying the design and reducing costs.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage ensures compatibility with various systems and allows for efficient power management.

Propagation Delay (tpd): 14.6 ns

The low propagation delay ensures fast and accurate signal transmission, which is crucial for bus drivers and transceivers in communication systems.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates that the bus driver and transceivers are designed to withstand the temperature fluctuations and harsh conditions often experienced in automotive applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the bus driver and transceivers energy-efficient and reliable in data transmission.

Technical Specifications

Bus Driver & Transceivers 74LVC240ADTR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

14.6 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74LVC240ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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