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74LVC07ADTR2G

Onsemi

74LVC07ADTR2G by Onsemi

74LVC07ADTR2G by Onsemi is a Logic Gates IC with 6 functions, operating at a supply voltage range of 1.65V to 5.5V. It features a propagation delay of 6.5ns and open-drain output characteristics, suitable for automotive applications due to its temperature grade of -40 °C to 125°C.

Median Price

$0.092

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 715 parts In-Stock

1+ parts

-

100+ parts

$0.092

1k+ parts

$0.077

10k+ parts

$0.068

715

-

$0.092

$0.077

$0.068

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,128 parts In-Stock

1+ parts

$0.072

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-

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1,128

$0.072

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Vyrian

USA . 5,631 parts In-Stock

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5,631

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Distributors (Availability)

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Corphita

USA . 702 parts In-Stock

1+ parts

$0.068

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-

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702

$0.068

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Corohmni

South Africa . 212 parts In-Stock

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$0.076

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212

$0.076

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AZTECH Wire

Italy . 76 parts In-Stock

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$12.860

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76

$12.860

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$37.752

100+ parts

$34.354

1k+ parts

$30.957

10k+ parts

-

2,000

$37.752

$34.354

$30.957

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QUARKTWIN TECHNOLOGY LTD

USA . 28,027 parts In-Stock

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Problanco Electronics

Mexico . 6,490 parts In-Stock

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TANS Electronics

Latvia . 5,188 parts In-Stock

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Kulean Microsystems

USA . 5,001 parts In-Stock

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Microchip USA

USA . 3,802 parts In-Stock

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SupplyDigital Components

Austria . 2,356 parts In-Stock

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UHIMA Technologies

Türkiye . 949 parts In-Stock

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Northwest PG Solutions

USA . 641 parts In-Stock

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Native Components

USA . 420 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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100

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Lucentia Tech

USA . 100 parts In-Stock

1+ parts

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100+ parts

$26.929

1k+ parts

$24.936

10k+ parts

$24.936

100

-

$26.929

$24.936

$24.936

Overview

Experience the superior quality and reliability of Onsemi with the 74LVC07ADTR2G Logic Gates. Designed for a wide range of applications, this product offers exceptional performance and value. With a nominal supply voltage of 3.3V and a propagation delay of just 6.5ns, this logic gate is perfect for automotive use as well as other industries. Trust in Onsemi's industry-leading technology to provide you with the best solution for your needs. Unlock the benefits and advantages of the 74LVC07ADTR2G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Allows for easy and secure installation on a circuit board, saving space and ensuring stability.

No. of Functions: 6

Offers versatility and flexibility in designing circuits with multiple functions.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a commonly used voltage level in electronic devices.

No. of Terminals: 14

Provides ample connectivity options for integrating the logic gates into a circuit.

Propagation Delay (tpd): 6.5 ns

Ensures fast signal processing and response time in the circuit.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for demanding environments.

Output Characteristics: OPEN-DRAIN

Allows for easy interfacing with other components in a circuit.

Minimum Operating Temperature: -40 °C

Can operate in cold temperatures, enhancing the product's versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for long-term reliability.

Technology: CMOS

Uses low power and offers high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Logic Gates 74LVC07ADTR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

6.5 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74LVC07ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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