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74HC574DTR2G

Onsemi

74HC574DTR2G by Onsemi

74HC574DTR2G by Onsemi is an 8-bit bus driver with a supply voltage of 3V, operating b/w -55 to 125 °C. It features a propagation delay of 240ns, output polarity as TRUE, and supports a max frequency of 20MHz. Ideal for applications requiring high-speed data transfer in compact spaces.

Median Price

$0.216

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 98,114 parts In-Stock

1+ parts

-

100+ parts

$0.225

1k+ parts

$0.186

10k+ parts

$0.166

98,114

-

$0.225

$0.186

$0.166

Verical

USA . 82,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.208

82,500

-

-

-

$0.208

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,181 parts In-Stock

1+ parts

$0.175

100+ parts

-

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2,181

$0.175

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Vyrian

USA . 5,545 parts In-Stock

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5,545

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PC Components Company LLC

USA . 808 parts In-Stock

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808

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Bristol Electronics

USA . 808 parts In-Stock

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808

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Sensible Micro Corp

USA . 25 parts In-Stock

1+ parts

-

100+ parts

$0.458

1k+ parts

$0.423

10k+ parts

-

25

-

$0.458

$0.423

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 92,805 parts In-Stock

1+ parts

$0.150

100+ parts

-

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92,805

$0.150

-

-

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Corphita

USA . 69 parts In-Stock

1+ parts

$0.166

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-

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69

$0.166

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Corohmni

South Africa . 101 parts In-Stock

1+ parts

$0.176

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101

$0.176

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Component Stockers USA

USA . 121,292 parts In-Stock

1+ parts

$0.190

100+ parts

$0.180

1k+ parts

$0.160

10k+ parts

$0.160

121,292

$0.190

$0.180

$0.160

$0.160

AZTECH Wire

Italy . 235 parts In-Stock

1+ parts

$10.710

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235

$10.710

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Perfect Parts

USA . 107,520 parts In-Stock

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107,520

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Continental Prestige Electronics

USA . 98,114 parts In-Stock

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$0.156

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98,114

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-

$0.156

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GreenTree Electronics

Israel . 96,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 21,933 parts In-Stock

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21,933

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Microchip USA

USA . 7,905 parts In-Stock

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7,905

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SupplyDigital Components

Austria . 3,681 parts In-Stock

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3,681

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TANS Electronics

Latvia . 3,473 parts In-Stock

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3,473

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Kulean Microsystems

USA . 2,187 parts In-Stock

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2,187

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Native Components

USA . 868 parts In-Stock

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$4.394

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868

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$4.394

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Northwest PG Solutions

USA . 678 parts In-Stock

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$4.439

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678

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$4.439

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Problanco Electronics

Mexico . 485 parts In-Stock

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485

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UHIMA Technologies

Türkiye . 465 parts In-Stock

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465

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Metaverse IC Inc.

Canada . 220 parts In-Stock

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220

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S.R.D Solutions

India . 200 parts In-Stock

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200

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Overview

Enhance your electronic designs with the 74HC574DTR2G by Onsemi, a top-quality bus driver & transceiver that provides seamless communication between components. With a compact and durable package body material, this product offers reliable performance in a wide range of applications. Experience the superior craftsmanship of Onsemi, known for delivering cutting-edge solutions. Elevate your projects with the precision and efficiency of the 74HC574DTR2G, ensuring optimal results every time. Unlock the potential of your designs with this versatile component that guarantees value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components, ensuring the reliability of the product.

Surface Mount: YES

Being surface mount compatible makes it easier to integrate this bus driver and transceiver into circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage of 3V makes it suitable for a wide range of applications and ensures compatibility with various systems.

Propagation Delay (tpd): 240 ns

The low propagation delay of 240ns ensures fast signal transmission and response times, making this product ideal for high-speed communication applications.

Minimum Operating Temperature: -55 °C

The wide operating temperature range of -55 °C ensures reliability in extreme environments, making this product suitable for a variety of applications.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity, making this product energy-efficient and suitable for reliable operation in various conditions.

Technical Specifications

Bus Driver & Transceivers 74HC574DTR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

74HC574DTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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