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1N4687

Onsemi

1N4687 by Onsemi

ZENER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;

Median Price

$5.740

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 810 parts In-Stock

1+ parts

$5.740

100+ parts

-

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810

$5.740

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Mouser Electronics

USA . 144 parts In-Stock

1+ parts

$5.740

100+ parts

$5.430

1k+ parts

$5.320

10k+ parts

-

144

$5.740

$5.430

$5.320

-

DigiKey

USA . 5 parts In-Stock

1+ parts

$5.740

100+ parts

$5.330

1k+ parts

-

10k+ parts

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5

$5.740

$5.330

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 5 parts In-Stock

1+ parts

$0.153

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-

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5

$0.153

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Digiode

USA . 1,802 parts In-Stock

1+ parts

$5.453

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1,802

$5.453

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NAC Semi

USA . 539 parts In-Stock

1+ parts

$6.040

100+ parts

$5.480

1k+ parts

$5.010

10k+ parts

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539

$6.040

$5.480

$5.010

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American Microsemiconductor Inc.

USA . 2,502 parts In-Stock

1+ parts

$18.250

100+ parts

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2,502

$18.250

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Chip Stock

USA . 26,000 parts In-Stock

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26,000

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Vyrian

USA . 8,530 parts In-Stock

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8,530

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Standard Data Resources

USA . 1,346 parts In-Stock

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1,346

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Component Electronics Inc.

Canada . 950 parts In-Stock

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950

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Technoshack Inc.

Canada . 354 parts In-Stock

1+ parts

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354

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Semi Source

USA . 175 parts In-Stock

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175

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Nova Conductors

Japan . 16 parts In-Stock

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16

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LittleDiode

UK . 7 parts In-Stock

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7

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 126 parts In-Stock

1+ parts

$0.099

100+ parts

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126

$0.099

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Aztec Data Supply Inc.

USA . 4,790 parts In-Stock

1+ parts

$0.174

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4,790

$0.174

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Corphita

USA . 2,147 parts In-Stock

1+ parts

$5.166

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2,147

$5.166

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AZTECH Wire

Italy . 657 parts In-Stock

1+ parts

$15.297

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657

$15.297

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QUARKTWIN TECHNOLOGY LTD

USA . 23,256 parts In-Stock

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23,256

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SupplyDigital Components

Austria . 8,245 parts In-Stock

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8,245

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TANS Electronics

Latvia . 7,756 parts In-Stock

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7,756

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West Coast Incorporated

USA . 7,670 parts In-Stock

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7,670

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Problanco Electronics

Mexico . 5,327 parts In-Stock

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5,327

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Microchip USA

USA . 4,677 parts In-Stock

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4,677

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Continental Prestige Electronics

USA . 4,255 parts In-Stock

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4,255

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Kulean Microsystems

USA . 2,697 parts In-Stock

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2,697

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Glotronic Ltd.

UK . 2,100 parts In-Stock

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Supply Digital

USA . 927 parts In-Stock

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927

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Aranea Global

USA . 500 parts In-Stock

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500

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UHIMA Technologies

Türkiye . 473 parts In-Stock

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473

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Perfect Parts

USA . 396 parts In-Stock

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396

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Argo Parts USA

USA . 193 parts In-Stock

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193

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Technical Specifications

Zener Diodes 1N4687 attributes and parameters. Explore more Zener Diodes devices from Onsemi

Specs

Additional Features:

METALLURGICALLY BONDED

Case Connection:

ISOLATED

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

JEDEC-95 Code:

DO-204AH

JESD-30 Code:

O-LALF-W2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

200 Cel

Package Body Material:

GLASS

Package Shape:

Package Style (Meter):

LONG FORM

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

.5 W

Qualification:

Not Qualified

Nominal Reference Voltage:

4.3 V

Sub-Category:

Voltage Reference Diodes

Surface Mount:

NO

Technology:

ZENER

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Position:

Maximum Voltage Tolerance:

5 %

Working Test Current:

.05 mA

Trade Compliance

1N4687 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

NSN

5961-00-068-4227, 5961000684227, 5961-01-345-8697, 5961013458697

NIIN

000684227, 013458697

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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