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UJA1168TK,118

NXP Semiconductors

UJA1168TK,118 by NXP Semiconductors

UJA1168TK,118 from NXP Semiconductors is a CAN transceiver designed for automotive applications. It features a data rate of 1 Mbps, operates on power supplies ranging from 3V to 28V, and has a compact 14-terminal surface mount design. This AEC-Q100 compliant device ensures reliable performance in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,074 parts In-Stock

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8,074

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Flip Electronics

USA . 6,250 parts In-Stock

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6,250

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Digiode

USA . 1,799 parts In-Stock

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1,799

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Anansix

USA . 100 parts In-Stock

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100

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Microchip USA

USA . 347 parts In-Stock

1+ parts

$3.498

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347

$3.498

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AZTECH Wire

Italy . 656 parts In-Stock

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$9.480

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656

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Component Stockers USA

USA . 666 parts In-Stock

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$99.990

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666

$99.990

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One Stop Electronics

USA . 1,149 parts In-Stock

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$117.000

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1,149

$117.000

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Perfect Parts

USA . 13,440 parts In-Stock

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13,440

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UNI Independent Distributors

Spain . 3,623 parts In-Stock

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3,623

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Corphita

USA . 3,195 parts In-Stock

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3,195

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Overview

Experience seamless connectivity with the UJA1168TK,118 from NXP Semiconductors, a trusted leader in innovative solutions. This advanced CAN transceiver ensures reliable communication across automotive and industrial applications, offering unmatched quality and performance. Designed for efficiency, it operates within a versatile voltage range and delivers robust data rates. Unlock the potential for smarter systems while benefiting from NXP's commitment to excellence and AEC-Q100 compliant reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection against environmental factors, making the product reliable in various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of board space and enables automated assembly, reducing manufacturing costs and improving performance.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures that the product meets strict automotive standards, making it suitable for demanding automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes layout flexibility on PCBs, facilitating better space utilization and thermal management.

Power Supplies (V): 3/28

Supports a wide range of operating voltages (3V to 28V), making the device versatile for different applications and power supply configurations.

No. of Terminals: 14

With 14 terminals, this product offers sufficient connectivity options for complex circuit designs, enhancing functionality without overcrowding.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes physical footprint while providing sufficient performance, ideal for compact electronic devices.

Terminal Position: DUAL

Dual terminal position enhances ease of routing and layout design on PCBs, simplifying integration into existing systems.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum peak reflow time of 30 seconds allows for sufficient heat exposure during soldering, ensuring good solder joints without damaging the component.

Peak Reflow Temperature °C: 260

Withstand a peak reflow temperature of 260 °C, the product can be used in high-temperature soldering processes without losing performance or reliability.

Terminal Form: NO LEAD

No-lead terminal form contributes to improved signal integrity and allows for a more compact design while reducing the risk of soldering defects.

Maximum Supply Current: 67 mA

The low maximum supply current of 67 mA enhances energy efficiency, making the product suitable for battery-powered applications.

Telecom IC Type: CAN TRANSCEIVER

As a CAN transceiver, this product is optimized for automotive and industrial communication applications, ensuring robust performance in networking.

Terminal Pitch: 0.635 mm

With a terminal pitch of 0.635 mm, the product is compatible with high-density designs, facilitating connections in space-constrained applications.

Data Rate: 1 Mbps

Supporting a data rate of 1 Mbps, this product delivers fast communication speeds, suitable for real-time control applications in various networks.

Technical Specifications

Network Interfaces UJA1168TK,118 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-N14

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

14

No. of Transceivers:

1

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC14,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/28

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Network Interfaces

Maximum Supply Current:

67 mA

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

UJA1168TK,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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