Loading...

UBA2213BT/N1,518

NXP Semiconductors

UBA2213BT/N1,518 by NXP Semiconductors

UBA2213BT/N1,518 by NXP Semiconductors is a robust switching regulator designed for automotive applications. It operates at a nominal voltage of 11.7 V and withstands temperatures from -40 °C to 150 °C. This surface-mount device features a compact 14-terminal gull-wing package for efficient integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,917 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,917

-

-

-

-

Anansix

USA . 1,096 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,096

-

-

-

-

Digiode

USA . 864 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

864

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 459 parts In-Stock

1+ parts

$1.470

100+ parts

-

1k+ parts

-

10k+ parts

-

459

$1.470

-

-

-

One Stop Electronics

USA . 859 parts In-Stock

1+ parts

$3.500

100+ parts

-

1k+ parts

-

10k+ parts

-

859

$3.500

-

-

-

AZTECH Wire

Italy . 1,100 parts In-Stock

1+ parts

$20.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,100

$20.800

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 23,370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23,370

-

-

-

-

UNI Independent Distributors

Spain . 1,277 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,277

-

-

-

-

Corphita

USA . 519 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

519

-

-

-

-

Overview

Elevate your designs with the UBA2213BT/N1,518 from NXP Semiconductors—a leader in innovative electronics. This cutting-edge switching regulator delivers unmatched reliability and efficiency for automotive applications, ensuring optimal performance even in extreme temperatures. With easy surface mount integration and robust quality assurance, it empowers your projects to thrive while offering exceptional value that drives customer satisfaction. Experience the NXP difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides excellent insulation and protects against environmental factors, ensuring durability and longevity of the product.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient use of PCB space, making it suitable for high-density applications.

Package Shape: RECTANGULAR

The rectangular package shape ensures optimal spacing and layout on the PCB, facilitating easier design and assembly.

Nominal Supply Voltage (Vsup): 11.7 V

A nominal supply voltage of 11.7 V is ideal for automotive applications, providing reliable power for various electronic systems.

Power Supplies (V): 11.7

The specification of 11.7 V for power supplies indicates compatibility with standard automotive power systems, enhancing versatility.

No. of Terminals: 14

Having 14 terminals allows for multiple connections and flexibility in circuit design, catering to diverse application needs.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes space usage on PCBs, making it preferable for compact electronic devices.

Maximum Operating Temperature: 150 °C

Operating reliably at a maximum of 150 °C ensures performance under high-temperature conditions prevalent in automotive environments.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C allows for functionality in extreme cold conditions, broadening the application range.

Terminal Position: DUAL

Dual terminal positioning enhances circuit flexibility and can simplify layout designs in complex applications.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with modern soldering techniques, facilitating efficient assembly processes.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade guarantees that the product meets the stringent requirements for automotive reliability and safety.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering reliability and mechanical strength, ensuring a robust connection on the PCB.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard in surface-mount technology, facilitating compatibility with automated placement equipment.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates a moderate sensitivity to moisture, allowing the device to be handled reasonably without special precautions prior to soldering.

Technical Specifications

Switching Regulators & Controllers UBA2213BT/N1,518 attributes and parameters. Explore more Switching Regulators & Controllers devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G14

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

14

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

11.7

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Nominal Supply Voltage (Vsup):

11.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

UBA2213BT/N1,518 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20