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UBA2017T/1,518

NXP Semiconductors

UBA2017T/1,518 by NXP Semiconductors

UBA2017T/1,518 by NXP Semiconductors is a robust switching regulator designed for automotive applications. It operates at a nominal voltage of 13 V and withstands temperatures from -40 °C to 125 °C. This surface-mount device features a compact 16-terminal gull-wing design for efficient integration.

Median Price

$1.212

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19,880 parts In-Stock

1+ parts

-

100+ parts

$1.190

1k+ parts

$0.988

10k+ parts

$0.881

19,880

-

$1.190

$0.988

$0.881

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.235

10k+ parts

$1.101

10,000

-

-

$1.235

$1.101

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,606 parts In-Stock

1+ parts

$0.926

100+ parts

-

1k+ parts

-

10k+ parts

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3,606

$0.926

-

-

-

DigiKey Marketplace

USA . 19,880 parts In-Stock

1+ parts

-

100+ parts

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19,880

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-

-

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Vyrian

USA . 2,725 parts In-Stock

1+ parts

-

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2,725

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-

-

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Anansix

USA . 2,356 parts In-Stock

1+ parts

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1k+ parts

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2,356

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,380 parts In-Stock

1+ parts

$0.878

100+ parts

-

1k+ parts

-

10k+ parts

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2,380

$0.878

-

-

-

AZTECH Wire

Italy . 1,085 parts In-Stock

1+ parts

$20.210

100+ parts

-

1k+ parts

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1,085

$20.210

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Microchip USA

USA . 11,044 parts In-Stock

1+ parts

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11,044

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UNI Independent Distributors

Spain . 5,832 parts In-Stock

1+ parts

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5,832

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Perfect Parts

USA . 2,800 parts In-Stock

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2,800

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Assy Fe

Spain . 80 parts In-Stock

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80

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Overview

Unlock exceptional reliability and performance with the UBA2017T/1,518 from NXP Semiconductors, a leader in innovative solutions. Designed for automotive applications, this switching regulator excels in demanding environments, offering thermal robustness and superior efficiency. Enjoy the benefits of compact design and surface mount technology, ensuring seamless integration into your projects. Enhance your systems with unparalleled quality and experience the difference that NXP’s expertise brings to your power management needs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resilience against environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mount enables easy integration into compact circuit designs, which is ideal for modern electronics with space constraints.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs and facilitates optimal thermal performance.

Nominal Supply Voltage (Vsup): 13 V

With a nominal supply voltage of 13 V, this product is compatible with a wide range of systems, ensuring versatility in its application.

Power Supplies (V): 13

Rated for a consistent 13 V input, it provides reliable power supply functionality, which is critical in automotive and industrial settings.

No. of Terminals: 16

Having 16 terminals supports complex configurations and multi-functionality, enhancing the product's versatility for various circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style is designed for high-density mounting, making it ideal for compact electronic devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this regulator can operate in challenging environments, ensuring reliability in automotive applications.

Minimum Operating Temperature: -40 °C

The capability to function at a minimum operating temperature of -40 °C makes it suitable for extreme weather conditions, ensuring wide-applicability.

Terminal Position: DUAL

The dual terminal position offers flexibility in layout design and aids in efficient soldering methods, contributing to increased manufacturability.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with standard soldering processes, contributing to ease of assembly and reducing production costs.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive temperature grades, this regulator can withstand the rigors of vehicle environments, enhancing safety and performance.

Terminal Form: GULL WING

The gull wing terminal form is recognized for its excellent solderability and provides strong mechanical support, ensuring secure connections.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compatibility with tight PCB layouts while minimizing the risk of solder bridging, enhancing reliability.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, it is designed to withstand standard handling procedures and assembly processes, ensuring operational integrity.

Technical Specifications

Switching Regulators & Controllers UBA2017T/1,518 attributes and parameters. Explore more Switching Regulators & Controllers devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G16

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

13

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Nominal Supply Voltage (Vsup):

13 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

UBA2017T/1,518 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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