Loading...

UBA2021T/N2-T

NXP Semiconductors

UBA2021T/N2-T by NXP Semiconductors

UBA2021T/N2-T by NXP Semiconductors is a robust switching regulator designed for automotive applications. It operates at a nominal voltage of 11V, with a temperature range from -40 °C to 150 °C. This surface-mount device features a compact 14-terminal gull-wing package for efficient integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,513 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,513

-

-

-

-

Digiode

USA . 2,440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,440

-

-

-

-

Vyrian

USA . 690 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

690

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,085 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,085

$0.500

-

-

-

Corphita

USA . 1,246 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,246

-

-

-

-

UNI Independent Distributors

Spain . 551 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

551

-

-

-

-

Overview

Elevate your designs with the UBA2021T/N2-T from NXP Semiconductors, a leader in innovative semiconductor solutions. This high-performance switching regulator is engineered for automotive applications, ensuring reliability and efficiency even in extreme temperatures. Its compact design and advanced features provide designers with enhanced flexibility and reduced footprint, delivering exceptional value that translates into superior product performance and customer satisfaction. Choose NXP for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for efficient use of PCB space and facilitates automated assembly processes, improving manufacturing efficiency.

Package Shape: RECTANGULAR

A rectangular package shape optimizes space on the circuit board and promotes easier integration into existing designs.

Nominal Supply Voltage (Vsup): 11 V

An 11V nominal supply voltage aligns well with common operational requirements in many electronic applications, ensuring compatibility with standard power sources.

Power Supplies (V): 11

Featuring a stable 11V power supply capability, this product provides reliable performance throughout various operating conditions.

No. of Terminals: 14

Having 14 terminals allows for versatile connections and greater integration potential within complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to reduced overall size and weight in designs, making it ideal for space-constrained applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C ensures reliability even in severe thermal environments, expanding the product's applicability.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is suitable for operation in extreme cold conditions, perfect for automotive and outdoor applications.

Terminal Position: DUAL

Dual terminal positioning enhances ease of soldering and integration onto PCBs, minimizing assembly complexity.

Temperature Grade: AUTOMOTIVE

Designed to automotive temperature standards, this product guarantees reliability and performance in demanding automotive environments.

Terminal Form: GULL WING

The gull wing terminal form provides improved mechanical strength and soldering ease, favoring robust electrical connections.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is ideal for compact designs, allowing closer placements of components on the circuit board while ensuring ease of soldering.

Technical Specifications

Switching Regulators & Controllers UBA2021T/N2-T attributes and parameters. Explore more Switching Regulators & Controllers devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G14

No. of Terminals:

14

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

11

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Nominal Supply Voltage (Vsup):

11 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

UBA2021T/N2-T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20