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UBA20272T/1,518

NXP Semiconductors

UBA20272T/1,518 by NXP Semiconductors

UBA20272T/1,518 by NXP Semiconductors is a robust switching regulator designed for industrial applications. It operates at a nominal voltage of 13V and withstands temperatures from -40 °C to 85 °C. Its compact surface mount design features 20 terminals with gull-wing form for efficient integration.

Median Price

$1.314

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 45,975 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

$1.110

10k+ parts

$1.050

45,975

-

$1.240

$1.110

$1.050

Avnet

USA . 45,975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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45,975

-

-

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Verical

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.387

10k+ parts

$1.313

42,000

-

-

$1.387

$1.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 508 parts In-Stock

1+ parts

$1.320

100+ parts

-

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508

$1.320

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-

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DigiKey Marketplace

USA . 45,975 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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45,975

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-

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Vyrian

USA . 5,376 parts In-Stock

1+ parts

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5,376

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Anansix

USA . 2,531 parts In-Stock

1+ parts

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2,531

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,911 parts In-Stock

1+ parts

$1.251

100+ parts

-

1k+ parts

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10k+ parts

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1,911

$1.251

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Microchip USA

USA . 6,952 parts In-Stock

1+ parts

$10.938

100+ parts

-

1k+ parts

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10k+ parts

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6,952

$10.938

-

-

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AZTECH Wire

Italy . 983 parts In-Stock

1+ parts

$11.170

100+ parts

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983

$11.170

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UNI Independent Distributors

Spain . 2,654 parts In-Stock

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2,654

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Discover the UBA20272T/1,518 from NXP Semiconductors—a top-tier switching regulator that combines remarkable reliability with superior performance. Designed for industrial applications, this compact and robust component ensures efficient power management even in extreme temperatures. With NXP's heritage of innovation, customers benefit from reduced design complexities and enhanced system efficiency. Elevate your projects with a solution that embodies quality and dependability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection against environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient manufacturing processes, which save space on the PCB.

Package Shape: RECTANGULAR

The rectangular package shape offers an efficient use of board space and facilitates better heat dissipation.

Nominal Supply Voltage (Vsup): 13 V

A nominal supply voltage of 13 V is versatile and suitable for a wide range of applications, ensuring consistent performance.

Power Supplies (V): 13

This product can accommodate a standardized power supply of 13 V, simplifying integration into existing systems.

No. of Terminals: 20

With 20 terminals, the component supports various connectivity options, enabling complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures a low profile which is ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C ensures reliability in high-temperature environments, extending the product's usability.

Minimum Operating Temperature: -40 °C

The wide operating temperature range, down to -40 °C, allows this product to be used in harsh and extreme conditions.

Terminal Position: DUAL

The dual terminal position enhances connectivity and facilitates integration into various circuit layouts.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C accommodates modern soldering techniques, ensuring compatibility with automated manufacturing.

Temperature Grade: INDUSTRIAL

The industrial temperature grade of this product signifies robustness and reliability in demanding applications.

Terminal Form: GULL WING

Gull wing terminals assist with ease of handling during assembly and can provide reliable solder joints.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm ensures compatibility with various PCB designs and supports high-density layouts.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the product can handle moderate humidity and requires standard precautions during soldering.

Technical Specifications

Switching Regulators & Controllers UBA20272T/1,518 attributes and parameters. Explore more Switching Regulators & Controllers devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G20

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

13

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Nominal Supply Voltage (Vsup):

13 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

UBA20272T/1,518 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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