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TJA1081TS,112

NXP Semiconductors

TJA1081TS,112 by NXP Semiconductors

TJA1081TS,112 by NXP Semiconductors is a robust telecom interface IC designed for network applications. It operates at 5V with a data rate of 10 Mbps and features a compact 16-terminal package. Ideal for automotive use, it meets AEC-Q100 screening standards.

Median Price

$1.940

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 165 parts In-Stock

1+ parts

-

100+ parts

$1.800

1k+ parts

$1.610

10k+ parts

$1.510

165

-

$1.800

$1.610

$1.510

DigiKey

USA . 165 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.080

10k+ parts

$2.080

165

-

-

$2.080

$2.080

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 813 parts In-Stock

1+ parts

$1.900

100+ parts

-

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813

$1.900

-

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Vyrian

USA . 4,005 parts In-Stock

1+ parts

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4,005

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-

-

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Anansix

USA . 2,574 parts In-Stock

1+ parts

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1k+ parts

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2,574

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-

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LIBRA Elektronik GmbH

Germany . 444 parts In-Stock

1+ parts

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444

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,805 parts In-Stock

1+ parts

$1.800

100+ parts

-

1k+ parts

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10k+ parts

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1,805

$1.800

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-

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Vigor

Singapore . 165 parts In-Stock

1+ parts

$1.920

100+ parts

-

1k+ parts

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10k+ parts

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165

$1.920

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Microchip USA

USA . 5,727 parts In-Stock

1+ parts

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5,727

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UNI Independent Distributors

Spain . 4,552 parts In-Stock

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4,552

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Perfect Parts

USA . 349 parts In-Stock

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349

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Overview

Elevate your connectivity with the TJA1081TS,112 from NXP Semiconductors—where quality meets innovation! This reliable network interface is designed for optimal performance in automotive applications, ensuring seamless communication and robust functionality. With NXP's reputation for excellence, enjoy peace of mind knowing you're backed by industry-leading technology. Experience efficiency and reliability that empower your projects to thrive—choose TJA1081TS,112 for superior value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of high-quality plastic/epoxy material ensures durability and reliability in various operating environments.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, making integration easier.

Screening Level: AEC-Q100

Meets automotive standards for reliability, ensuring performance in harsh conditions, making it suitable for automotive applications.

Package Shape: RECTANGULAR

Rectangular shapes can provide efficient layout options on PCBs, enhancing design flexibility.

Power Supplies (V): 5

Operates at a standard 5V supply, making it compatible with various applications and easy to integrate into existing systems.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and functionalities, providing greater utility in interfaces.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline design makes the component ideal for space-constrained applications, aiding in compact product designs.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and ensures robust connections during assembly processes.

Terminal Position: DUAL

Dual terminal positioning promotes versatile and flexible mounting options, accommodating various PCB designs.

Maximum Seated Height: 2 mm

The low seated height allows for adherence to space-saving requirements in compact electronic designs.

Width: 5.3 mm

A compact width aids in fitting the component into narrow spaces on PCBs, enhancing layout efficiency.

Maximum Time At Peak Reflow Temperature: 30 s

Short peak reflow times minimize thermal stress on sensitive components, ensuring longevity and reliability.

Peak Reflow Temperature: 260 C

A high peak temperature tolerance allows for compatibility with various soldering processes in manufacturing.

Length: 6.2 mm

The length is optimized for integration in compact designs, facilitating high-density assemblies.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical support and solder joint reliability in surface mount applications.

Maximum Supply Current: 0.037 mA

Low supply current consumption contributes to energy efficiency, making it suitable for battery-operated devices.

Telecom IC Type: INTERFACE CIRCUIT

Designed specifically for telecom applications, ensuring optimized performance for communication interfaces.

Nominal Supply Voltage: 5 V

Nominal voltage compatibility adds to its versatility for use in a wide range of electronic devices.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density device packing, essential for modern electronics.

Data Rate: 10 Mbps

Supports a maximum data rate of 10 Mbps, making it suitable for applications requiring moderate data throughput.

Technical Specifications

Network Interfaces TJA1081TS,112 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

10 Mbps

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

6.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

No. of Transceivers:

1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

2 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.037 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

TJA1081TS,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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