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TJA1050T/N1,518

NXP Semiconductors

TJA1050T/N1,518 by NXP Semiconductors

NXP Semiconductors' TJA1050T/N1,518 is a CMOS interface circuit with 8 terminals and 5V supply voltage. Operating b/w -40 to 125°C, it offers data rates up to 1 Mbps for automotive applications. This small outline package with nickel palladium gold finish is ideal for network interfaces in surface mount designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,023 parts In-Stock

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Anansix

USA . 2,260 parts In-Stock

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2,260

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Digiode

USA . 1,433 parts In-Stock

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Nova Conductors

Japan . 75 parts In-Stock

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Microchip USA

USA . 328 parts In-Stock

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$7.481

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328

$7.481

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AZTECH Wire

Italy . 315 parts In-Stock

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$10.795

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315

$10.795

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Corohmni

South Africa . 895 parts In-Stock

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$11.955

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895

$11.955

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Aztec Data Supply Inc.

USA . 4,917 parts In-Stock

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$15.840

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4,917

$15.840

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Semicontronic

India . 1,304 parts In-Stock

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$186.000

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$181.350

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$180.420

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One Stop Electronics

USA . 302 parts In-Stock

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$474.000

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302

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Ampacity Inc.

Singapore . 978 parts In-Stock

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$740.000

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978

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UNI Independent Distributors

Spain . 7,400 parts In-Stock

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Corphita

USA . 4,477 parts In-Stock

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Continental Prestige Electronics

USA . 2,421 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Argo Parts USA

USA . 384 parts In-Stock

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384

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Overview

Enhance your automotive network interfaces with the TJA1050T/N1,518 by NXP Semiconductors. Designed with high-quality materials and advanced CMOS technology, this small outline package offers reliable performance in extreme temperatures, making it perfect for automotive applications. With a data rate of 1 Mbps and low supply current, this interface circuit provides seamless connectivity and efficient power usage for your vehicles. Trust NXP Semiconductors to deliver cutting-edge solutions for your networking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it a good choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation of the product on a printed circuit board, saving time and effort.

Power Supplies (V): 5

Operating at a voltage of 5V is common and widely compatible, making the product suitable for a variety of systems and devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, increasing its reliability and longevity.

Technology: CMOS

The CMOS technology ensures low power consumption and high noise immunity, making the product energy efficient and reliable in noisy environments.

Technical Specifications

Network Interfaces TJA1050T/N1,518 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.075 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1050T/N1,518 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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