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TJA1050T/N1,118

NXP Semiconductors

TJA1050T/N1,118 by NXP Semiconductors

NXP Semiconductors' TJA1050T/N1,118 is a network interface IC with 8 terminals and 5V supply voltage. It operates at -40 to 125°C, suitable for automotive applications. With a data rate of 1 Mbps, it features CMOS technology and Gull Wing terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,679 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 2,658 parts In-Stock

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Anansix

USA . 2,152 parts In-Stock

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Digiode

USA . 2,054 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 200 parts In-Stock

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$11.294

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Microchip USA

USA . 336 parts In-Stock

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$12.007

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336

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Aztec Data Supply Inc.

USA . 4,125 parts In-Stock

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$15.920

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AZTECH Wire

Italy . 794 parts In-Stock

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$16.118

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Ampacity Inc.

Singapore . 411 parts In-Stock

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$201.000

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Semicontronic

India . 1,192 parts In-Stock

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$421.000

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$410.475

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$408.370

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One Stop Electronics

USA . 723 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,310 parts In-Stock

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Continental Prestige Electronics

USA . 6,776 parts In-Stock

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Corphita

USA . 2,855 parts In-Stock

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Argo Parts USA

USA . 2,573 parts In-Stock

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UNI Independent Distributors

Spain . 2,380 parts In-Stock

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Advanced Electronics

New Zealand . 268 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unlock the power of seamless networking with the NXP Semiconductors TJA1050T/N1,118. Designed with precision and expertise, this network interface offers unparalleled reliability and performance. From automotive applications to telecommunications, this product sets the standard for quality and innovation. Experience the value of effortless connectivity and the benefits of cutting-edge technology with the TJA1050T/N1,118 by NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact and space-saving design, ideal for tight layout requirements.

Power Supplies (V): 5

With a power supply of 5V, this product is compatible with common voltage standards and easy to integrate into existing systems.

No. of Terminals: 8

The 8 terminals offer flexibility for connecting multiple components and peripherals, enhancing functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for high-density board integration.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in harsh environments without overheating.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can withstand extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options and simplified connectivity.

Maximum Seated Height: 1.75 mm

The low maximum seated height makes this product suitable for compact devices and applications with height restrictions.

Width: 3.9 mm

The narrow width of 3.9mm enables seamless integration into space-constrained designs.

Length: 4.9 mm

The short length of 4.9mm contributes to the overall compactness and efficiency of the product.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets stringent temperature and performance requirements for reliable operation in vehicles.

Technology: CMOS

The CMOS technology ensures low power consumption and high-speed operation, making it an energy-efficient choice.

Terminal Form: GULL WING

The gull wing terminal form offers strong mechanical support and easy soldering for secure connections.

Maximum Supply Current: 0.075 mA

With a maximum supply current of 0.075mA, this product consumes minimal power during operation, enhancing energy efficiency.

Telecom IC Type: INTERFACE CIRCUIT

The interface circuit type is optimized for telecom applications, providing reliable and stable communication.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is compatible with standard power sources, ensuring easy integration and compatibility.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and secure connection to other components, enhancing reliability.

Data Rate: 1 Mbps

With a data rate of 1Mbps, this product delivers high-speed data transmission, making it suitable for fast and efficient communication applications.

Technical Specifications

Network Interfaces TJA1050T/N1,118 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.075 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1050T/N1,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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