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TJA1041T/N1,118

NXP Semiconductors

TJA1041T/N1,118 by NXP Semiconductors

NXP Semiconductors' TJA1041T/N1,118 is a network interface IC with 14 terminals in a small outline package. It operates at 5V nominal voltage and has Gull Wing terminal form. Ideal for telecom applications requiring interface circuits due to its compact size and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,215 parts In-Stock

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Digiode

USA . 2,442 parts In-Stock

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Sternenhof Electronics

Switzerland . 1,553 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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550

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Anansix

USA . 123 parts In-Stock

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123

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Distributors (Availability)

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Microchip USA

USA . 332 parts In-Stock

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$1.742

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332

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AZTECH Wire

Italy . 876 parts In-Stock

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$12.741

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One Stop Electronics

USA . 788 parts In-Stock

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$84.000

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Ampacity Inc.

Singapore . 1,631 parts In-Stock

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$710.000

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QUARKTWIN TECHNOLOGY LTD

USA . 9,815 parts In-Stock

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UNI Independent Distributors

Spain . 4,513 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Corphita

USA . 1,784 parts In-Stock

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Overview

Elevate your network interfaces with the TJA1041T/N1,118 by NXP Semiconductors. Known for their top-quality components and innovative technology, NXP Semiconductors delivers unparalleled reliability and performance in every product. The TJA1041T/N1,118 is designed to seamlessly integrate into various applications, providing customers with a durable and efficient solution for their networking needs. Experience the value and benefits of NXP Semiconductors as you enhance your network capabilities with the TJA1041T/N1,118.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight design, making it an ideal choice for network interfaces.

Surface Mount: YES

With the ability to be surface mounted, this product offers easy installation and saves valuable space on PCBs.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on circuit boards and helps optimize space utilization.

No. of Terminals: 14

The 14 terminals provide ample connectivity options, making this product suitable for a wide range of network interface applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances the overall compactness of the product, making it ideal for space-constrained applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures high conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB mounting, allowing for versatile layout options to accommodate various design requirements.

Maximum Seated Height: 1.75 mm

The low maximum seated height contributes to a slim profile, making this product suitable for compact electronic devices.

Width: 3.9 mm

The narrow width of 3.9 mm enables efficient space utilization on PCBs, making it a practical choice for densely packed electronic systems.

Length: 8.65 mm

With a length of 8.65 mm, this product strikes a balance between compactness and functionality, providing a versatile solution for networking applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and robust mechanical attachment, ensuring reliable connectivity in network interfaces.

Telecom IC Type: INTERFACE CIRCUIT

The telecom IC type interface circuit offers advanced functionality and compatibility, making it a reliable choice for telecommunications equipment.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V provides compatibility with standard power sources, ensuring seamless integration into existing network systems.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm offers high-density interconnection capabilities, making this product suitable for data-intensive network applications.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product is resistant to moisture-induced damage, ensuring long-term reliability in diverse environmental conditions.

Technical Specifications

Network Interfaces TJA1041T/N1,118 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1041T/N1,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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