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TJA1020T/VM,118

NXP Semiconductors

TJA1020T/VM,118 by NXP Semiconductors

NXP Semiconductors' TJA1020T/VM,118 is an AEC-Q100 compliant interface circuit with 8 terminals in a small outline package. It operates at a nominal voltage of 12V and has a peak reflow temperature of 260°C. Ideal for automotive applications requiring robust network interfaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,732 parts In-Stock

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Anansix

USA . 2,780 parts In-Stock

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2,780

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Sensible Micro Corp

USA . 1,858 parts In-Stock

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Digiode

USA . 1,813 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 965 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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Bristol Electronics

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Distributors (Availability)

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Microchip USA

USA . 168 parts In-Stock

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$4.264

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Corohmni

South Africa . 185 parts In-Stock

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$9.559

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Aztec Data Supply Inc.

USA . 3,225 parts In-Stock

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$9.689

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AZTECH Wire

Italy . 691 parts In-Stock

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$14.117

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One Stop Electronics

USA . 1,591 parts In-Stock

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Ampacity Inc.

Singapore . 673 parts In-Stock

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$976.000

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Continental Prestige Electronics

USA . 6,315 parts In-Stock

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Kepictronics

USA . 4,500 parts In-Stock

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UNI Independent Distributors

Spain . 3,495 parts In-Stock

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Corphita

USA . 3,251 parts In-Stock

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Perfect Parts

USA . 2,800 parts In-Stock

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Argo Parts USA

USA . 2,403 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Assy Fe

Spain . 98 parts In-Stock

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Overview

Enhance your network connectivity with the TJA1020T/VM,118 by NXP Semiconductors. Known for their superior quality and innovative technology, NXP Semiconductors delivers reliable solutions for various applications in the Network Interfaces category. This product offers unmatched value, providing customers with seamless communication and enhanced performance. Say goodbye to connectivity issues and experience the benefits of a top-tier interface circuit with the TJA1020T/VM,118.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for long-term use.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on a circuit board, saving time and effort during assembly.

Screening Level: AEC-Q100

This product meets the rigorous automotive industry standards, ensuring high reliability and performance in automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape offers efficient use of board space, making it suitable for compact devices and systems.

No. of Terminals: 8

With 8 terminals available, this product provides ample connectivity options for various networking needs.

Package Style (Meter): SMALL OUTLINE

The small outline package style is space-saving and convenient for applications where board space is limited.

Terminal Position: DUAL

The dual terminal position offers flexibility in installation, allowing for versatile mounting options on the circuit board.

Maximum Seated Height: 1.75 mm

The low maximum seated height ensures compatibility with slim and compact devices, making it an ideal choice for space-constrained applications.

Width: 3.9 mm

The narrow width of 3.9 mm allows for a compact design, making it suitable for integration into small electronic devices.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures secure attachment to the circuit board during assembly, maintaining reliable connections.

Length: 4.9 mm

The short length of 4.9 mm contributes to a compact and space-efficient design, suitable for devices with limited space available.

Terminal Form: GULL WING

The gull wing terminal form provides reliable electrical connections and ease of soldering, ensuring secure and stable performance.

Telecom IC Type: INTERFACE CIRCUIT

The telecom IC type interface circuit enables seamless communication between devices, making it a versatile and valuable component for networking applications.

Nominal Supply Voltage: 12 V

The 12V nominal supply voltage provides stable and consistent power for the product, ensuring reliable performance in demanding networking environments.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch offers precise and secure connections on the circuit board, enhancing the overall reliability of the product.

Technical Specifications

Network Interfaces TJA1020T/VM,118 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1020T/VM,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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