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TJA1020T/VM,112

NXP Semiconductors

TJA1020T/VM,112 by NXP Semiconductors

NXP Semiconductors' TJA1020T/VM,112 is an AEC-Q100 compliant interface circuit with 8 terminals in a small outline package. It operates at a nominal voltage of 12V and has a peak reflow temperature of 260°C. Ideal for automotive applications requiring reliable network interfaces in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,890 parts In-Stock

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4,890

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Digiode

USA . 4,025 parts In-Stock

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4,025

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Anansix

USA . 1,242 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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Speed Components Ltd

Israel . 45 parts In-Stock

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45

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Distributors (Availability)

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Microchip USA

USA . 359 parts In-Stock

1+ parts

$9.460

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359

$9.460

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Aztec Data Supply Inc.

USA . 4,131 parts In-Stock

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$12.263

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$12.263

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Corohmni

South Africa . 212 parts In-Stock

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$12.787

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212

$12.787

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AZTECH Wire

Italy . 576 parts In-Stock

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$19.016

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576

$19.016

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Ampacity Inc.

Singapore . 863 parts In-Stock

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$544.000

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863

$544.000

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One Stop Electronics

USA . 1,203 parts In-Stock

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$837.000

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Corphita

USA . 4,715 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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UNI Independent Distributors

Spain . 1,818 parts In-Stock

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Continental Prestige Electronics

USA . 1,140 parts In-Stock

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Argo Parts USA

USA . 1,102 parts In-Stock

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Overview

Enhance your network connectivity with the NXP Semiconductors TJA1020T/VM,112. This high-quality interface circuit offers unrivaled reliability and performance, thanks to NXP's cutting-edge technology and stringent screening standards. Its compact design and versatile applications make it a valuable asset for various industries. Experience seamless data transmission and optimal efficiency with this innovative solution. Upgrade your network infrastructure today with the TJA1020T/VM,112 and stay ahead of the curve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where portability and longevity are important.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and reducing production costs.

Screening Level: AEC-Q100

AEC-Q100 certification ensures high reliability and quality, making this product suitable for automotive applications where ruggedness is crucial.

Package Shape: RECTANGULAR

Rectangular shape offers compatibility with standard PCB layouts, making integration into existing designs simple and convenient.

No. of Terminals: 8

Having 8 terminals provides ample connectivity options, allowing for versatile usage in various networking applications.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it suitable for compact designs or applications with limited board real estate.

Terminal Position: DUAL

Dual terminal position allows for stable and secure connections, minimizing the risk of signal loss or interference.

Maximum Seated Height: 1.75 mm

Low seated height enables a slim profile, making this product suitable for thin devices or applications where space is a constraint.

Width: 3.9 mm

Narrow width saves PCB space, contributing to efficient use of board real estate and allowing for more components to be integrated.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable soldering during assembly, contributing to the overall durability and quality of the product.

Length: 4.9 mm

Compact length makes this product suitable for space-constrained applications or designs where a small form factor is required.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy and secure soldering, ensuring robust electrical connections for improved performance and reliability.

Telecom IC Type: INTERFACE CIRCUIT

Interface circuit telecom IC type enhances communication capabilities, making this product suitable for networking applications requiring reliable data transmission.

Nominal Supply Voltage: 12 V

Compatible with a 12V nominal supply voltage, this product can be easily integrated into standard power systems, simplifying deployment and reducing compatibility issues.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for high-density mounting on the PCB, enabling compact designs and optimizing board space utilization.

Technical Specifications

Network Interfaces TJA1020T/VM,112 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1020T/VM,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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