Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TEF6657HN/V101 by NXP Semiconductors is a robust telecom interface IC designed for industrial applications. It operates within -40 °C to 85 °C, features a 3.3V nominal voltage, and comes in a compact 32-terminal chip carrier package. Ideal for reliable communication in harsh environments.
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The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.
Surface mount technology allows for compact design and improves assembly efficiency, making it ideal for modern electronics.
AEC-Q100 certification indicates this product meets automotive reliability standards, making it suitable for critical applications.
The square package shape optimizes space utilization on circuit boards, allowing for more efficient designs.
A higher number of terminals provides more connectivity options, enabling complex circuit implementations.
Chip carrier packages facilitate easy mounting and provide better heat dissipation for improved performance.
A maximum operating temperature of 85 °C makes this IC suitable for industrial applications with moderate thermal requirements.
With a minimum operating temperature of -40 °C, this IC can endure harsh environmental conditions, making it reliable in extreme scenarios.
Quad terminal positioning allows for efficient layout and facilitates better signal integrity in PCB designs.
Being rated for industrial temperature grades ensures that the product can operate in more challenging environments without failure.
No lead terminals reduce the risk of solder joints failing due to thermal stress, promoting long-term reliability.
Designed specifically for telecom applications, this IC provides optimized performance for communication systems.
Operating at a nominal supply voltage of 3.3 V aligns with standard digital logic levels, making integration easy with other components.
Other Function Telecom Interface ICs TEF6657HN/V101 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
No. of Functions:
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Package Body Material:
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TEF6657HN/V101 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LM358M
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
SS14
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Forward Voltage (VF): .5 V;
OPA2277UA/2K5E4
Texas Instruments
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
LL4148-GS08
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
1N4148
Taitron Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
USB3320C-EZK-TR
Microchip Technology
Microchip Technology's USB3320C-EZK-TR is a Bus Controller IC with 32 terminals, operating at 1.6-2V. It supports USB bus compatibility, clock frequency up to 60MHz, and CMOS technology. Ideal for applications requiring Universal Serial Bus peripherals in compact designs with low power consumption.
1N4148WT
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Kec
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
FDLL4148
FDLL4148 by Onsemi is a single rectifier diode with a max reverse recovery time of 0.004 us. With a max forward voltage of 1V and output current of 0.2A, it is ideal for applications requiring fast switching speeds in electronic circuits. The diode's glass package body material and isolated case connection make it suitable for surface mount designs operating at temperatures up to 175°C.
2N2222A
Bharat Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SN6505BDBVR
SN6505BDBVR by Texas Instruments is a small outline, low profile interface IC with 6 terminals. It operates b/w -55 to 125°C and supports a max output current of 1.5A at supply voltages ranging from 2.25V to 5.5V. Ideal for military-grade applications requiring compact design and high reliability.
1N4148W-T
1N4148W-T by Micro Commercial Components is a single rectifier diode with a max reverse recovery time of 0.004 us. It operates b/w -55 to 150 °C and has a max output current of 0.15 A. Ideal for applications requiring fast switching speeds in small outline packages.
LM317T
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-PSFM-T3; Adjustability: ADJUSTABLE; Package Equivalence Code: SIP3,.1TB;
Cheng-yi Electronic
CC0603KRX7R9BB103
Yageo
Yageo CC0603KRX7R9BB103 is a 0603 SMT ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
Micro Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
EQCO30R5.D
Microchip Technology's EQCO30R5.D is a telecom IC with 16 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3.3V, it features nickel palladium gold terminal finish and very thin profile design for telecom circuit applications.
MAX7033EUI
Maxim Integrated
MAX7033EUI by Maxim Integrated is a telecom IC with 28 terminals, operating at -40 to 105°C. It has a supply voltage of 3.3V, consumes 0.00688mA current, and features GULL WING terminals for industrial applications in telecom circuits.
RS9116W-SB00-QMS-B24
Silicon Labs
TELECOM CIRCUIT;
BGM240SA22VNA2
MGM240PA22VNA3
RS9116W-SB00-B00
Silicon Labs RS9116W-SB00-B00 is a telecom IC with 126 terminals, operating from -40 to 85°C. It has a supply voltage of 1.85V and is designed for industrial applications requiring surface mount technology in a grid array package.
ZGM130S037HGN2R
ZGM130S037HGN2R by Silicon Labs is a telecom IC with 64 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial use. Nominal voltage of 1.8V, ideal for telecom circuit applications.
MAX7044AKA-T
MAX7044AKA-T by Maxim Integrated is a telecom IC with 8 terminals, operating at -40 to 125°C. It has a supply voltage of 2.7V and low power consumption of 0.0257mA, suitable for automotive applications due to its CMOS technology and small form factor.
ZM5202AE-CME3R
Silicon Labs ZM5202AE-CME3R is a telecom IC with 18 terminals, operating at -10 to 85°C. It has a data rate of 0.1 Mbps and operates at 3.3V nominal voltage. This rectangular package is ideal for telecom interface applications requiring surface mount assembly in microelectronic setups.
MRF24WB0MA/RM
MRF24WB0MA/RM by Microchip: 3.3V supply, 36 terminals, telecom IC for commercial use. Rectangular package, surface mountable. Ideal for telecom circuit applications in temperatures from 0 to 70°C.
SX1278IMLTRT
Semtech
Semtech's SX1278IMLTRT is a 28-terminal telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It features a square chip carrier package and matte tin finish, suitable for industrial applications requiring reliable telecom circuit interfaces in compact spaces.
MGC3030-I/SS
MGC3030-I/SS by Microchip is a telecom IC with 28 terminals, operating from -40 to 85°C. It has a small outline package, matte tin finish, and nominal voltage of 3.3V. Ideal for telecom circuits, it features gull wing terminals and is suitable for industrial temperature grades.
XB3-24ACM-J
Digi International
Digi International's XB3-24ACM-J is a TELECOM CIRCUIT with 1 Mbps Data Rate. Operating from -40 to 85 °C, it comes in RECTANGULAR package style. Ideal for telecom interfaces, this IC is designed for various applications requiring high-speed data transmission.
TM266DVA1
Pulser
TELECOM CIRCUIT; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;
CC2520RHDRG4
CC2520RHDRG4 by Texas Instruments is a Telecom IC with 28 terminals, operating b/w -40 to 125°C. It features a data rate of 0.25 Mbps, suitable for automotive applications due to its CMOS technology and 3V supply voltage requirement. The package style is chip carrier with a very thin profile, making it ideal for surface mount applications.
ADRV9002BBCZ
Analog Devices
Analog Devices ADRV9002BBCZ is a telecom IC with 196 terminals in a grid array package. It operates b/w -40 to 110°C, with a nominal voltage of 1V. Ideal for telecom circuits, it has a thin profile and fine pitch design for surface mounting applications.
XB3-24Z8UT
The Digi International XB3-24Z8UT is an industrial-grade telecom circuit with 20 terminals in a through-hole package. It operates b/w -40°C to 85°C, making it suitable for various telecom interface applications. This MICROELECTRONIC ASSEMBLY offers reliable performance in harsh environments.
BG96MA-128-SGN
Quectel Wireless Solutions
BG96MA-128-SGN by Quectel is a telecom IC with 102 terminals, operating from -40 to 85°C. It has a compact rectangular package, measuring 22.5mm in width and 26.5mm in length, suitable for industrial applications requiring a nominal voltage of 3.8V.
MCP2140A-I/P
MCP2140A-I/P by Microchip: Telecom IC with 18 terminals, CMOS tech, 3V supply voltage. Ideal for telecom circuits in industrial settings. Operating temp -40 to 85°C, package style in-line, TS 16949 screening level.
NRF24L01P-R
Nordic Semiconductor Asa
NRF24L01P-R by Nordic Semiconductor Asa is a 20-terminal telecom IC with 3V supply voltage, operating from -40 to 85°C. It comes in a square chip carrier package and is surface-mountable. Ideal for industrial applications requiring wireless communication at peak reflow temp of 260°C.
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TEF6657HN/V101,518
NXP Semiconductors
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: QCCN; Package Shape: SQUARE;
TEF6657HN/V102K
TELECOM CIRCUIT; Terminal Finish: NICKEL PALLADIUM GOLD; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
TEF6657HN/V102Y
TELECOM CIRCUIT; JESD-609 Code: e4; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Terminal Finish: NICKEL PALLADIUM GOLD;
TEF6659HN/V101
TEF6659HN/V102K
TELECOM CIRCUIT; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: NICKEL PALLADIUM GOLD;
TEF6659HN/V102Y
TELECOM CIRCUIT; JESD-609 Code: e4; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL PALLADIUM GOLD; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3;
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