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TEA5712TD

NXP Semiconductors

TEA5712TD by NXP Semiconductors

TEA5712TD by NXP Semiconductors is a compact audio single-chip receiver designed for AM/FM demodulation. It features a low harmonic distortion of 0.8%, a signal-to-noise ratio of 26 dB, and operates b/w 2V to 12V, ideal for various audio applications. Its small outline package ensures easy surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,871 parts In-Stock

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4,871

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Anansix

USA . 2,897 parts In-Stock

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2,897

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Vyrian

USA . 2,544 parts In-Stock

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2,544

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 174 parts In-Stock

1+ parts

$18.800

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174

$18.800

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UNI Independent Distributors

Spain . 4,489 parts In-Stock

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4,489

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Corphita

USA . 3,321 parts In-Stock

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3,321

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Overview

Elevate your audio experience with the TEA5712TD from NXP Semiconductors, a leader in innovative technology. This single-chip audio receiver delivers exceptional sound quality while ensuring low distortion and high reliability. Perfect for consumer electronics and automotive applications, its compact design allows for seamless integration. Trust NXP's commitment to excellence; choose the TEA5712TD for enhanced performance and unmatched value in your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection from environmental factors, making this receiver IC suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient space utilization on printed circuit boards, enabling compact designs.

Package Shape: RECTANGULAR

The rectangular shape is suitable for standard layouts, enhancing compatibility with existing designs and assembly processes.

General IC Type: AUDIO SINGLE CHIP RECEIVER

Being an audio single chip receiver simplifies design complexity and reduces component count, making it ideal for audio applications.

Harmonic Distortion: 0.8 %

A low harmonic distortion of 0.8% ensures high audio quality, making it a great choice for premium audio devices.

No. of Terminals: 32

With 32 terminals, this IC provides extensive connectivity options for versatile integration into various systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style keeps the footprint minimal, perfect for space-constrained applications.

Terminal Position: DUAL

Dual terminal positioning facilitates easier assembly and connection in multi-layer PCB designs.

Maximum Seated Height: 2.65 mm

A maximum seated height of only 2.65 mm allows for low-profile designs, essential for portable electronics.

Nominal Signal to Noise Ratio (FM): 26 dB

With a nominal signal-to-noise ratio of 26 dB, this IC provides clear audio reception, enhancing user experience.

Width: 7.5 mm

The compact width of 7.5 mm is suitable for small form factor devices, providing design flexibility.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage of 2V enables compatibility with battery-operated devices, promoting energy efficiency.

Length: 20.5 mm

At a length of 20.5 mm, this IC fits well into various electronic designs while maintaining performance.

Demodulation Type: AM/FM

The capability to demodulate AM/FM signals makes this IC versatile for different audio transmission systems.

Terminal Form: GULL WING

Gull wing terminals facilitate automated assembly processes, improving manufacturing efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard, easing integration with PCB designs and soldering processes.

Maximum Supply Voltage (Vsup): 12 V

A maximum supply voltage of 12V gives designers flexibility in power supply options for different devices.

Technical Specifications

Receiver ICs TEA5712TD attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

.8 %

JESD-30 Code:

R-PDSO-G32

Length:

20.5 mm

No. of Terminals:

32

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Signal to Noise Ratio (FM):

26 dB

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TEA5712TD General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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