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TDA8296HN/C1,518

NXP Semiconductors

TDA8296HN/C1,518 by NXP Semiconductors

TDA8296HN/C1,518 by NXP Semiconductors is a CMOS consumer IC designed for surface mount applications. It operates b/w -20 °C and 85 °C with power supplies of 1.2V and 3.3V, featuring a compact 40-terminal chip carrier package. Ideal for various electronic devices, it ensures reliable performance in diverse environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,490 parts In-Stock

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7,490

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Digiode

USA . 3,796 parts In-Stock

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3,796

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Anansix

USA . 580 parts In-Stock

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580

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Distributors (Availability)

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AZTECH Wire

Italy . 827 parts In-Stock

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$11.380

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827

$11.380

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One Stop Electronics

USA . 186 parts In-Stock

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$12.800

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186

$12.800

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UNI Independent Distributors

Spain . 7,484 parts In-Stock

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7,484

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Corphita

USA . 2,894 parts In-Stock

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2,894

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Perfect Parts

USA . 2,240 parts In-Stock

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Overview

Discover the TDA8296HN/C1,518 from NXP Semiconductors—a powerhouse in consumer ICs that guarantees exceptional quality and reliability. With its innovative design and durable construction, this versatile component is perfect for a range of applications, ensuring optimal performance even in demanding environments. Choose NXP for cutting-edge technology that enhances your products, providing unparalleled value and peace of mind. Elevate your designs with the TDA8296HN/C1,518 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making this IC reliable in various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easy integration into modern circuit boards, enhancing space efficiency.

Package Shape: SQUARE

Square package shape optimizes space on PCB, allowing for denser component placement and improved thermal management.

Power Supplies (V): 1.2, 3.3

Offers voltage flexibility, making the product suitable for a wide range of applications, from low-power to higher voltage devices.

No. of Terminals: 40

With 40 terminals, this IC supports complex functionalities and higher interconnectivity, ideal for advanced applications.

Package Style (Meter): CHIP CARRIER

Chip carrier style enhances thermal performance and signal integrity, ensuring efficient operation in high-frequency applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the IC to perform reliably in demanding environments, increasing its versatility.

Minimum Operating Temperature: -20 °C

Low minimum temperature ensures functionality in colder conditions, broadening the range of possible applications.

Terminal Position: QUAD

Quad terminal positioning facilitates proper heat dissipation and effective signal routing, contributing to improved overall performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature suggests compatibility with various soldering techniques, easing manufacturing processes.

Technology: CMOS

CMOS technology is known for low power consumption and high noise immunity, making this IC ideal for battery-powered devices.

Terminal Form: NO LEAD

No lead design minimizes the environmental impact and allows for a more compact integration in electronic devices.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is suitable for high-density applications, enabling manufacturers to create smaller and more efficient PCBs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate humidity sensitivity, providing guidance for safe handling and storage, thus ensuring the product’s longevity.

Technical Specifications

Other Function Consumer ICs TDA8296HN/C1,518 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N40

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA8296HN/C1,518 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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