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TDA5145T

NXP Semiconductors

TDA5145T by NXP Semiconductors

TDA5145T from NXP Semiconductors is a brushless DC motor controller with a nominal voltage of 14.5V and a max output current of 2.5A. It features a compact SO package (7.5mm x 17.9mm) and operates in temperatures from 0 °C to 70 °C. Ideal for motion control applications, it supports surface mount technology for efficient integration.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Digiode

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Vyrian

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Q Components

USA . 2,853 parts In-Stock

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Legend Electronics Inc.

USA . 2,000 parts In-Stock

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Anansix

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Prism Electronics

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Atlantic Semiconductor

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Bristol Electronics

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LIBRA Elektronik GmbH

Germany . 73 parts In-Stock

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GES GmbH

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One Stop Electronics

USA . 1,305 parts In-Stock

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UNI Independent Distributors

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A-Z Elektronik GmbH

Germany . 4,782 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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Overview

Elevate your motion control projects with the TDA5145T from NXP Semiconductors, a leader in innovative technology. This high-performance brushless DC motor controller delivers unparalleled precision and efficiency, ensuring smooth operation in various applications, from robotics to industrial automation. With robust reliability and energy-saving benefits, the TDA5145T empowers you to create exceptional products that stand out in today’s competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as a package body material provides durability and protection from environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mount compatible enables easier integration into compact circuit designs, allowing for improved PCB layout and reduced assembly time.

Package Shape: RECTANGULAR

The rectangular package shape is optimized for efficient use of board space, facilitating a more compact circuit design.

Nominal Supply Voltage (Vsup): 14.5 V

The nominal supply voltage of 14.5 V ensures the IC operates effectively within a standard range, making it reliable for various applications.

Power Supplies (V): 14.5

Consistent power supply ratings ensure stable operation of the device, enhancing performance and reducing the risk of failure.

No. of Terminals: 28

With 28 terminals, the IC provides ample connectivity options, enabling complex functionality and integration into advanced systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for efficient use of space on the PCB, facilitating high-density designs.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C indicates the IC can operate in a wide range of environments without compromising performance.

Minimum Operating Temperature: 0 °C

The 0 °C minimum operating temperature ensures functionality in lower temperature environments, expanding its application range.

Terminal Position: DUAL

Dual terminal positioning supports versatile mounting options, simplifying PCB layout and assembly.

Maximum Seated Height: 2.65 mm

A low seated height enables compliance with space-constrained designs, ideal for compact electronics.

Width: 7.5 mm

With a width of 7.5 mm, the IC is designed for space-efficient placements while maintaining high connectivity.

Other IC type: BRUSHLESS DC MOTOR CONTROLLER

As a brushless DC motor controller, this IC is specifically designed for efficient motor management, enhancing system performance.

Minimum Supply Voltage (Vsup): 4 V

A minimum supply voltage of 4 V allows for flexibility in power supply choice, enabling use in a variety of systems.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C is suitable for standard soldering processes, ensuring compatibility with modern manufacturing techniques.

Length: 17.9 mm

The length of 17.9 mm allows optimal space utilization on PCB layouts without sacrificing functionality.

Temperature Grade: COMMERCIAL

Being rated for commercial temperatures indicates reliability in general consumer applications, ensuring consistent performance.

Maximum Supply Current (Isup): 7.8 mA

A maximum supply current of 7.8 mA indicates energy efficiency, reducing overall power consumption in applications.

Maximum Output Current: 2.5 A

The ability to handle a maximum output current of 2.5 A allows the IC to drive powerful motors, making it highly versatile.

Technology: BIPOLAR

With bipolar technology, the IC offers high performance and fast switching speeds, enhancing overall responsiveness in motor control applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and solderability, facilitating reliable connections on the PCB.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm ensures compatibility with standard PCB layouts, simplifying integration and assembly.

Maximum Supply Voltage (Vsup): 18 V

The capability to handle up to 18 V supply voltage allows for versatile applications, making it adaptable to various power requirements.

Technical Specifications

Motion Control ICs TDA5145T attributes and parameters. Explore more Motion Control ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

2.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

14.5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

7.8 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

14.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

TDA5145T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5961-01-611-3384, 5961016113384

NIIN

016113384

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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