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TDA1535B

NXP Semiconductors

TDA1535B by NXP Semiconductors

SAMPLE AND HOLD CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,086 parts In-Stock

1+ parts

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4,086

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Digiode

USA . 2,372 parts In-Stock

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2,372

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Anansix

USA . 2,037 parts In-Stock

1+ parts

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2,037

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Pegasus Components GmbH

Germany . 49 parts In-Stock

1+ parts

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49

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Fibra_Brandt Electronic GMBH

Germany . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,125 parts In-Stock

1+ parts

$4.410

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1,125

$4.410

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UNI Independent Distributors

Spain . 2,813 parts In-Stock

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Corphita

USA . 1,231 parts In-Stock

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1,231

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Assy Fe

Spain . 3 parts In-Stock

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Technical Specifications

Sample & Hold ICs TDA1535B attributes and parameters. Explore more Sample & Hold ICs devices from NXP Semiconductors

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sampling Mode:

Sample and Hold (S&H)

Performance Specifications

Nominal Acquisition Time:

2 µs

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6 V

Maximum Negative Supply Voltage:

-5 V

Minimum Supply Voltage:

-6 V

Lowest Operating Temperature:

-30 °C (-22 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Maximum Analog Input Voltage:

2.82 V

Physical Characteristics

Length:

INCH_MILLIMETER

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.16 in (4.06 mm)

Total Terminals:

16

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDIP-T16

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Style (Meter):

In Line

Trade Compliance

TDA1535B Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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