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TBA120U

NXP Semiconductors

TBA120U by NXP Semiconductors

NXP Semiconductors' TBA120U is an audio demodulator IC with FM demodulation type. It features 1% harmonic distortion, operates b/w 0-70°C, and requires a supply voltage of 10-18V. With 42 terminals in an inline package style, it's ideal for commercial-grade receiver applications.

Median Price

$9.800

Lifecycle Status

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Forefront Electronics and Design

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Digital Electronic Gebert Verwaltungs UG

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Fibra_Brandt Electronic GMBH

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Modulus Dynamics

Lithuania . 2,615 parts In-Stock

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Overview

Upgrade your audio experience with the TBA120U by NXP Semiconductors, a high-quality receiver IC perfect for enhancing your audio devices. Manufactured by the renowned NXP Semiconductors, this audio demodulator offers superior performance with minimal harmonic distortion, ensuring crystal-clear sound. With its versatile applications in FM demodulation, this product guarantees top-notch quality and reliability. Trust NXP Semiconductors to deliver exceptional value and benefits to your audio projects. Elevate your audio game with the TBA120U today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Harmonic Distortion: 1 %

Low harmonic distortion ensures high-quality audio output with minimal interference or distortion.

Maximum Operating Temperature: 70 °C

Can operate effectively in a wide range of temperatures, making it suitable for various environments.

Nominal Output Voltage (FM): 176.75 mV

Provides a consistent and reliable output voltage for FM signals, ensuring stable performance.

Demodulation Type: FM

Designed specifically for FM demodulation, ensuring accurate signal processing for audio devices.

Technical Specifications

Receiver ICs TBA120U attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

FM

Harmonic Distortion:

1 %

JESD-30 Code:

R-PDIP-T42

Length:

19.025 mm

No. of Functions:

1

No. of Terminals:

42

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Nominal Output Voltage (FM):

176.75 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Current:

17.5 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TBA120U General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-12-330-8400, 5962123308400

NIIN

123308400

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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