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SE97TP/S900,547

NXP Semiconductors

SE97TP/S900,547 by NXP Semiconductors

SE97TP/S900,547 by NXP Semiconductors is a versatile sensor with an operating temp range of -40 °C to 125 °C. It features an 8-terminal surface mount design and operates on power supplies of 1.8V/3.3V, making it ideal for various applications in electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,696 parts In-Stock

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6,696

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Digiode

USA . 3,920 parts In-Stock

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3,920

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Anansix

USA . 1,538 parts In-Stock

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1,538

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 160 parts In-Stock

1+ parts

$0.986

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160

$0.986

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AZTECH Wire

Italy . 1,040 parts In-Stock

1+ parts

$17.790

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1,040

$17.790

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One Stop Electronics

USA . 660 parts In-Stock

1+ parts

$44.750

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660

$44.750

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UNI Independent Distributors

Spain . 4,129 parts In-Stock

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4,129

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Corphita

USA . 2,055 parts In-Stock

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2,055

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Overview

Unlock unparalleled performance with the SE97TP/S900,547 by NXP Semiconductors. Renowned for quality and innovation, NXP delivers a versatile transducer that excels in demanding environments, ensuring reliability even in extreme temperatures. Ideal for automotive and industrial applications, this compact sensor enhances system efficiency while minimizing power consumption. Experience the perfect blend of durability and precision, elevating your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this product suitable for various applications.

Power Supplies: 1.8/3.3V

Supports both 1.8V and 3.3V power supplies, offering flexibility for integration into a wide range of electronic systems.

No. of Terminals: 8

With 8 terminals, this product provides versatile connectivity options, allowing for easy integration and connection in compact designs.

Package Shape or Style: RECTANGULAR

The rectangular package shape is ideal for surface mount applications, optimizing space usage on PCBs.

Maximum Operating Temperature: 125 °C

Able to operate at temperatures up to 125 °C, this product is suitable for high-temperature environments, enhancing its reliability.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this sensor can function in extreme cold conditions, making it suitable for harsh environments.

Maximum Operating Current: 0.4 mA

A low maximum operating current of 0.4 mA helps in power efficiency, making this sensor ideal for battery-operated devices.

Mounting Feature: SURFACE MOUNT

The surface mount feature simplifies the assembly process and allows for a smaller, more compact design, which is essential for modern electronic applications.

Technical Specifications

Other Function Sensors & Transducers SE97TP/S900,547 attributes and parameters. Explore more Other Function Sensors & Transducers devices from NXP Semiconductors

Specs

Mounting Feature:

No. of Terminals:

8

Maximum Operating Current:

.4 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SOLCC8,.12,20

Package Shape or Style:

Power Supplies (V):

1.8/3.3

Sub-Category:

Other Sensors

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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