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SE97TK-T

NXP Semiconductors

SE97TK-T by NXP Semiconductors

SE97TK-T by NXP Semiconductors is a versatile sensor with a rectangular plastic/epoxy package. It operates b/w -40 °C and 125 °C, powered by 1.8V to 3.3V, and features surface mount technology with 8 terminals. Ideal for various applications in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,042 parts In-Stock

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4,042

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Digiode

USA . 1,780 parts In-Stock

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1,780

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Anansix

USA . 595 parts In-Stock

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595

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Distributors (Availability)

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One Stop Electronics

USA . 1,038 parts In-Stock

1+ parts

$53.750

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1,038

$53.750

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UNI Independent Distributors

Spain . 6,728 parts In-Stock

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6,728

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Corphita

USA . 2,305 parts In-Stock

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2,305

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Overview

Elevate your devices with the SE97TK-T from NXP Semiconductors—your trusted partner in innovation. This advanced sensor delivers exceptional performance across a range of applications, from automotive to industrial automation. With a robust design and reliable temperature resilience, it ensures consistent quality and efficiency. Benefit from NXP's commitment to excellence and unlock the potential for smarter solutions that enhance user experience and drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy for the package body ensures lightweight design and enhances durability, making it suitable for various environmental conditions.

Power Supplies (V): 1.8/3.3

A flexible power supply range allows for compatibility with multiple systems and reduces voltage regulation requirements, thus enhancing device efficiency.

No. of Terminals: 8

With 8 terminals, it provides versatile connectivity options, simplifying integration into different circuit designs.

Package Shape or Style: RECTANGULAR

The rectangular package shape is efficient for surface mounting, optimizing board space and improving layout flexibility.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures makes this sensor ideal for applications in demanding environments, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

A wide operating temperature range allows this sensor to function effectively in extreme conditions, making it suitable for outdoor and industrial applications.

Maximum Operating Current: 0.4 mA

Low operating current contributes to energy efficiency, making it a great choice for battery-powered devices and applications where power conservation is critical.

Mounting Feature: SURFACE MOUNT

Surface mount technology reduces the physical footprint on PCB, allowing for compact designs and increased manufacturing efficiency.

Technical Specifications

Other Function Sensors & Transducers SE97TK-T attributes and parameters. Explore more Other Function Sensors & Transducers devices from NXP Semiconductors

Specs

Mounting Feature:

No. of Terminals:

8

Maximum Operating Current:

.4 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SOLCC8,.11,20

Package Shape or Style:

Power Supplies (V):

1.8/3.3

Sub-Category:

Other Sensors

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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