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SE97TP,147

NXP Semiconductors

SE97TP,147 by NXP Semiconductors

SE97TP,147 by NXP Semiconductors is a versatile sensor with a power supply range of 1.8/3.3V and operates in extreme temperatures from -40 °C to 125 °C. It features an 8-terminal surface mount design and consumes a max current of just 0.4mA. Ideal for various applications in electronics, it ensures reliable performance in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,841 parts In-Stock

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Digiode

USA . 4,163 parts In-Stock

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Anansix

USA . 1,411 parts In-Stock

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AZTECH Wire

Italy . 996 parts In-Stock

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$18.630

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996

$18.630

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One Stop Electronics

USA . 511 parts In-Stock

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$43.750

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511

$43.750

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Component Stockers USA

USA . 714 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 19,679 parts In-Stock

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19,679

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Microchip USA

USA . 5,651 parts In-Stock

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UNI Independent Distributors

Spain . 4,430 parts In-Stock

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Corphita

USA . 1,171 parts In-Stock

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Overview

Unlock the potential of your projects with the SE97TP,147 from NXP Semiconductors—a leader in innovative solutions. This versatile sensor excels in demanding environments, delivering reliable performance from -40 °C to 125 °C. Its compact design and surface mount capabilities ensure seamless integration, perfect for various applications like automotive and industrial systems. Choose NXP for unparalleled quality and experience enhanced efficiency, precision, and longevity in your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body provides excellent protection against environmental factors, making this product suitable for a variety of applications.

Power Supplies (V): 1.8/3.3

With dual voltage options, this product is flexible and can be easily integrated into different systems requiring low power supply.

No. of Terminals: 8

The 8 terminals allow for versatile connections and functionalities, enhancing the overall performance and adaptability in various applications.

Package Shape or Style: RECTANGULAR

The rectangular package design is space-efficient, making it easier to incorporate into compact electronic devices.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures of up to 125 °C ensures reliability and stability in demanding environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is designed to function reliably in extreme cold conditions.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides excellent solderability, ensuring strong connections and enhancing the longevity of the product.

Maximum Operating Current: 0.4 mA

The low operating current of 0.4 mA minimizes power consumption, making this sensor an energy-efficient choice for various applications.

Mounting Feature: SURFACE MOUNT

The surface mount feature enables easy integration onto PCBs, saving space and simplifying the manufacturing process.

Technical Specifications

Other Function Sensors & Transducers SE97TP,147 attributes and parameters. Explore more Other Function Sensors & Transducers devices from NXP Semiconductors

Specs

JESD-609 Code:

e3

Mounting Feature:

No. of Terminals:

8

Maximum Operating Current:

.4 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SOLCC8,.12,20

Package Shape or Style:

Power Supplies (V):

1.8/3.3

Sub-Category:

Other Sensors

Terminal Finish:

Matte Tin (Sn)

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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