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SE97TL,147

NXP Semiconductors

SE97TL,147 by NXP Semiconductors

SE97TL,147 by NXP Semiconductors is a versatile sensor with an operating temp range of -40 °C to 125 °C. It features an 8-terminal surface mount design and operates on power supplies of 1.8/3.3V, making it ideal for various applications in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,380 parts In-Stock

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Digiode

USA . 2,315 parts In-Stock

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2,315

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Anansix

USA . 1,267 parts In-Stock

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1,267

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AZTECH Wire

Italy . 809 parts In-Stock

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$19.390

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809

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One Stop Electronics

USA . 254 parts In-Stock

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$54.750

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254

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Corphita

USA . 4,665 parts In-Stock

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4,665

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UNI Independent Distributors

Spain . 4,179 parts In-Stock

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Microchip USA

USA . 3,712 parts In-Stock

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Overview

Unlock a world of innovation with the SE97TL,147 by NXP Semiconductors. Renowned for their commitment to quality and reliability, NXP delivers a sensor solution that excels in diverse applications, from consumer electronics to industrial automation. With its robust performance across extreme temperatures and efficient power consumption, this device empowers your projects with precision and durability, ensuring you stay ahead in today’s competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and resistance to environmental factors, making this sensor suitable for a wide range of applications.

Power Supplies (V): 1.8/3.3

The dual voltage supply option allows for versatile integration into various systems, enhancing compatibility with both low and standard voltage applications.

No. of Terminals: 8

With 8 terminals, this sensor supports a range of functionalities while ensuring reliable electrical connections, making it versatile for multiple configurations.

Package Shape or Style: RECTANGULAR

The rectangular form factor optimizes board space in compact designs and allows for easier placement in various electronic assemblies.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability in demanding environments, making this product suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

The ability to function at temperatures as low as -40 °C makes this sensor ideal for use in extreme cold environments.

Maximum Operating Current: 0.4 mA

Low power consumption at a maximum operating current of 0.4 mA promotes energy efficiency, extending battery life in portable applications.

Mounting Feature: SURFACE MOUNT

Surface mount technology allows for automated assembly processes and reduces the overall footprint on PCBs, making it a practical choice for modern electronics.

Technical Specifications

Other Function Sensors & Transducers SE97TL,147 attributes and parameters. Explore more Other Function Sensors & Transducers devices from NXP Semiconductors

Specs

Mounting Feature:

No. of Terminals:

8

Maximum Operating Current:

.4 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SOLCC8,.12,20

Package Shape or Style:

Power Supplies (V):

1.8/3.3

Sub-Category:

Other Sensors

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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