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SCC2691AC1A28,518

NXP Semiconductors

SCC2691AC1A28,518 by NXP Semiconductors

SCC2691AC1A28,518 by NXP Semiconductors is a Serial Communication Controller with 5V supply voltage, 4MHz clock frequency, and 0.0046875 MBps data transfer rate. It is used for asynchronous communication in commercial-grade applications requiring low power mode and CMOS technology.

Median Price

$9.944

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,688 parts In-Stock

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6,688

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Digiode

USA . 4,299 parts In-Stock

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4,299

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Sensible Micro Corp

USA . 750 parts In-Stock

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$9.944

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$9.241

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750

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$9.944

$9.241

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Anansix

USA . 385 parts In-Stock

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385

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Bristol Electronics

USA . 31 parts In-Stock

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31

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 900 parts In-Stock

1+ parts

$11.000

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900

$11.000

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One Stop Electronics

USA . 226 parts In-Stock

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$13.000

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226

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AZTECH Wire

Italy . 809 parts In-Stock

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$16.453

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809

$16.453

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Microchip USA

USA . 158 parts In-Stock

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$77.128

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158

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Corphita

USA . 562 parts In-Stock

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562

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Aranea Global

USA . 500 parts In-Stock

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500

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UNI Independent Distributors

Spain . 109 parts In-Stock

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Overview

Revolutionize your communication systems with the SCC2691AC1A28,518 by NXP Semiconductors. Designed with precision and quality in mind, this Serial Communication Controller offers unparalleled performance and reliability. From industrial automation to consumer electronics, this versatile product is the perfect solution for a wide range of applications. Experience seamless data transfer, low power consumption, and easy integration with the SCC2691AC1A28,518. Upgrade your technology today and unlock endless possibilities with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, perfect for applications where weight and durability are important.

Surface Mount: YES

This feature allows for easy and convenient installation on a circuit board, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, making this product versatile and adaptable.

Address Bus Width: 3

The 3-bit address bus width provides flexibility in addressing different memory locations, enhancing the product's functionality.

Package Shape: SQUARE

The square package shape is space-efficient and allows for easy integration into compact electronic devices.

Power Supplies (V): 5

The 5V power supply ensures standard voltage compatibility, making this product easy to integrate into existing systems.

No. of Terminals: 28

The numerous terminals offer a wide range of connectivity options, allowing for versatile integration with other components.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides a streamlined and compact design, ideal for space-constrained applications.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures efficient operation even in low-power environments, making this product energy-efficient.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range ensures reliable performance even in harsh industrial environments.

Maximum Data Transfer Rate: 0.0046875 MBps

The high data transfer rate enables fast and efficient communication, essential for time-sensitive applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature range allows for reliable performance even in cold environments.

Terminal Finish: TIN

The tin terminal finish provides corrosion resistance and ensures long-term reliability in various operating conditions.

Terminal Position: QUAD

The quad terminal position offers stable connectivity and enhances signal integrity for optimal performance.

Maximum Seated Height: 4.57 mm

The low seated height saves space and allows for compact device designs, perfect for applications with size constraints.

Width: 11.505 mm

The compact width of the product makes it suitable for integration into tight spaces and small electronic devices.

Data Encoding or Decoding Method: NRZ

The NRZ encoding/decoding method ensures accurate data transmission, critical for reliable communication.

External Data Bus Width: 8

The wide external data bus width allows for high-speed data transfer and efficient communication.

Communication Protocol: ASYNC, BIT

The support for asynchronous communication and bit-based protocols offers flexibility and compatibility with a variety of systems.

Maximum Clock Frequency: 4 MHz

The high clock frequency allows for fast data processing and efficient operation in demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time at peak temperature ensures quick and effective soldering during manufacturing.

Peak Reflow Temperature °C: 245

The high peak reflow temperature ensures strong and reliable solder joints for long-lasting performance.

Length: 11.505 mm

The compact length of the product makes it suitable for integration into small electronic devices and tight spaces.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance in standard operating conditions.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The serial IO and communication controller type offers versatile connectivity options for a wide range of applications.

Technology: CMOS

The CMOS technology provides low power consumption and high-speed operation, making this product energy-efficient and reliable.

Terminal Form: J BEND

The J-bend terminal form offers secure connectivity and easy soldering during assembly, ensuring a reliable connection.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures standard power compatibility, making this product easy to integrate into various systems.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for compact design and efficient use of space on the circuit board.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate sensitivity to moisture, making this product suitable for typical indoor environments.

Low Power Mode: YES

The low power mode feature allows for energy-saving operation and enhanced battery life in portable devices.

Technical Specifications

Serial Communication Controllers SCC2691AC1A28,518 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

4 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.0046875 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11.505 mm

Trade Compliance

SCC2691AC1A28,518 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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