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SC16C750BIA44,512

NXP Semiconductors

SC16C750BIA44,512 by NXP Semiconductors

SC16C750BIA44,512 by NXP Semiconductors is a Serial Communication Controller with 44 terminals and operates at 48 MHz clock frequency. It supports data transfer rate of 0.375 MBps and communication protocols like ASYNC and BIT. Ideal for industrial applications requiring low power mode and reliable serial IO/communication control.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 6,903 parts In-Stock

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Digiode

USA . 3,824 parts In-Stock

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Anansix

USA . 542 parts In-Stock

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Nova Conductors

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Ampacity Inc.

Singapore . 1,472 parts In-Stock

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$3.000

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One Stop Electronics

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Microchip USA

USA . 174 parts In-Stock

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$5.082

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AZTECH Wire

Italy . 582 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 345 parts In-Stock

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Overview

Discover the power and reliability of NXP Semiconductors with the SC16C750BIA44,512 Serial Communication Controller. This innovative chip offers seamless communication solutions for a wide range of applications, from industrial automation to consumer electronics. With a maximum supply voltage of 5.5V and a data transfer rate of 0.375 MBps, this chip delivers exceptional performance in any environment. Trust NXP Semiconductors to provide quality products that bring value and efficiency to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage tolerance ensures compatibility with a wide range of power sources.

Address Bus Width: 3

The 3-bit address bus width allows for multiple devices to be connected on the same bus for better system integration.

Package Shape: SQUARE

The square package shape provides better stability and easier alignment during installation on the PCB.

Power Supplies (V): 2.5/5

The dual power supply option allows for flexibility in design and operation, catering to different voltage requirements.

No. of Terminals: 44

Having a high number of terminals enables connectivity with a wide range of external devices and peripherals.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good thermal performance and efficient signal routing for improved reliability.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures that the product can function reliably even in low-power scenarios.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions without performance degradation.

Maximum Data Transfer Rate: 0.375 MBps

The high data transfer rate allows for quick and efficient communication between devices, improving overall system performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function in extreme cold environments without issues.

Terminal Finish: Tin/Silver (Sn/Ag)

The tin/silver terminal finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: QUAD

The quad terminal position allows for easy soldering and PCB mounting, enhancing the product's reliability and durability.

Maximum Seated Height: 4.57 mm

With a low maximum seated height, the product can be compactly integrated into tight spaces without sacrificing performance.

Width: 16.585 mm

The compact width makes the product suitable for applications where space is limited, without compromising on functionality.

External Data Bus Width: 8

The wide 8-bit external data bus width allows for high-speed data transfer and efficient communication with external devices.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication and bit-level data transfer enables versatile connectivity options with different devices.

Maximum Clock Frequency: 48 MHz

The high maximum clock frequency allows for fast data processing and communication, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

The product's short time at peak reflow temperature ensures reliable soldering during manufacturing without damaging the components.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance ensures that the product can withstand the soldering process without degradation.

Length: 16.585 mm

The compact length allows for easy integration into tight spaces without compromising on functionality.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures the product can operate reliably in demanding industrial environments.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The product's serial IO and communication controller functionality allows for efficient data transmission and device connectivity.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product suitable for a wide range of applications.

Terminal Form: J BEND

The J bend terminal form provides strong mechanical support and reliable connectivity during installation and operation.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with standard power sources, making the product easy to integrate into existing systems.

Terminal Pitch: 1.27 mm

The tight terminal pitch allows for high-density PCB layouts and efficient signal routing for improved performance.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product can withstand moderate moisture exposure during storage and operation.

Low Power Mode: YES

The low power mode feature allows the product to operate in power-efficient modes when not performing intensive tasks, extending battery life.

Technical Specifications

Serial Communication Controllers SC16C750BIA44,512 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 2.5 V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

48 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.375 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e2

Length:

16.585 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver (Sn/Ag)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.585 mm

Trade Compliance

SC16C750BIA44,512 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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