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SA58671UK-G

NXP Semiconductors

SA58671UK-G by NXP Semiconductors

SA58671UK-G by NXP Semiconductors is a compact audio amplifier designed for industrial applications. It operates at 3/5V with a max supply current of 9mA and features a square, fine pitch grid array package. This device supports two functions and withstands temperatures from -40 °C to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Lantek

USA . 12,000 parts In-Stock

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12,000

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Digiode

USA . 1,030 parts In-Stock

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1,030

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Vyrian

USA . 658 parts In-Stock

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658

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Anansix

USA . 216 parts In-Stock

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216

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 741 parts In-Stock

1+ parts

$3.800

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741

$3.800

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GreenTree Electronics

Israel . 6,000 parts In-Stock

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6,000

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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UNI Independent Distributors

Spain . 2,991 parts In-Stock

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2,991

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Corphita

USA . 942 parts In-Stock

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942

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Overview

Experience superior audio quality with the SA58671UK-G from NXP Semiconductors, a trusted leader in innovation. This robust audio amplifier boasts exceptional performance and reliability, making it perfect for industrial applications. With its compact design and efficient power use, it elevates sound clarity while reducing energy costs. Choose the SA58671UK-G for unmatched quality, ensuring your projects resonate with excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern electronic circuits, saving space on PCBs.

No. of Functions: 2

Having multiple functions in one package enhances versatility, making the amplifier suitable for a broader range of applications.

Package Shape: SQUARE

The square shape aids in efficient space utilization on PCBs and simplifies the layout design.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, it offers high fidelity and audio performance, ideal for enhancing sound quality in audio systems.

Power Supplies (V): 3/5

Operating at low voltage (3/5V) allows for energy efficiency and compatibility with battery-operated devices.

No. of Terminals: 16

With 16 terminals, this amplifier accommodates multiple connections, increasing its application versatility.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array design enables higher density component placement, promoting miniaturization in circuit design.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The capability to function at -40 °C makes this amplifier suitable for extreme conditions and various outdoor applications.

Terminal Position: BOTTOM

Bottom terminal positioning optimizes space on the surface of the PCB and improves soldering efficiency.

Temperature Grade: INDUSTRIAL

An industrial temperature grade signifies robustness, ensuring the device can handle harsh operating environments.

Terminal Form: BALL

Ball terminal form enhances solder joint reliability and enables better thermal dissipation.

Maximum Supply Current: 9 mA

A maximum supply current of 9 mA signifies low power consumption, extending battery life in portable devices.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for compact device design, supporting high-density connections on small PCBs.

Technical Specifications

Audio & Video Amplifiers SA58671UK-G attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B16

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA16,4X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

9 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Trade Compliance

SA58671UK-G General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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