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SA58670ABS-G

NXP Semiconductors

SA58670ABS-G by NXP Semiconductors

SA58670ABS-G by NXP Semiconductors is a versatile audio amplifier designed for industrial applications. It operates on 3/5V power supplies, features a compact chip carrier package with 20 terminals, and supports temperatures from -40 °C to 85 °C. Ideal for surface mount designs, it delivers efficient performance in audio systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,659 parts In-Stock

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4,659

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Vyrian

USA . 1,170 parts In-Stock

1+ parts

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1k+ parts

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1,170

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Anansix

USA . 1,146 parts In-Stock

1+ parts

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1,146

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 445 parts In-Stock

1+ parts

$4.800

100+ parts

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1k+ parts

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445

$4.800

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UNI Independent Distributors

Spain . 8,256 parts In-Stock

1+ parts

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8,256

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Corphita

USA . 3,685 parts In-Stock

1+ parts

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3,685

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Overview

Elevate your audio experience with the SA58670ABS-G from NXP Semiconductors, a trusted leader in innovative technology. This cutting-edge audio amplifier delivers exceptional sound quality and reliability for diverse applications—from consumer electronics to industrial systems. Its compact design ensures seamless integration while operating efficiently in extreme temperatures. Choose the SA58670ABS-G to enjoy premium audio performance that meets your needs with unmatched durability and precision!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as a package body material ensures durability and resistance to environmental factors, making this amplifier reliable in various applications.

Surface Mount: YES

Being surface mount compatible allows for compact designs and easy integration into modern electronics, making it a versatile choice for designers.

No. of Functions: 2

With two functions, this amplifier provides flexibility for different audio processing tasks, catering to diverse application needs.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on PCBs, allowing for denser circuit layouts without compromising performance.

General IC Type: AUDIO AMPLIFIER

As a dedicated audio amplifier, it is optimized for sound quality and performance, making it an excellent choice for high-fidelity audio applications.

Power Supplies (V): 3/5

Operating on low voltage supplies (3V to 5V) enhances its energy efficiency, making it suitable for battery-powered devices.

No. of Terminals: 20

The 20 terminals provide ample connectivity options, facilitating integration with various circuit designs and ensuring robust performance.

Package Style (Meter): CHIP CARRIER

The chip carrier package style allows for easy handling and mounting, offering a practical solution for manufacturers.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the amplifier is capable of functioning in demanding environments, ensuring reliability under high-stress conditions.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C enables this product to perform in extreme cold conditions, expanding its application range.

Terminal Position: QUAD

The quad terminal arrangement ensures ease of routing and connections on PCBs, improving design efficiency.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grades, this amplifier guarantees stability and performance in a wide range of environmental conditions.

Terminal Form: NO LEAD

No lead terminals enhance safety and reduce environmental impact, aligning with modern manufacturing practices.

Maximum Supply Current: 9 mA

With a maximum supply current of only 9 mA, this amplifier is energy-efficient, making it an ideal choice for portable devices.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for high-density designs, enabling the incorporation of this amplifier into compact electronic devices.

Technical Specifications

Audio & Video Amplifiers SA58670ABS-G attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N20

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

9 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

SA58670ABS-G General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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