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SA5205AD

NXP Semiconductors

SA5205AD by NXP Semiconductors

WIDE BAND LOW POWER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Operating Temperature: 85 Cel;

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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Netsource Technology, Inc.

USA . 16,415 parts In-Stock

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M&R Communications

USA . 4,034 parts In-Stock

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4,034

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Digiode

USA . 2,567 parts In-Stock

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Anansix

USA . 1,538 parts In-Stock

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Vyrian

USA . 168 parts In-Stock

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168

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LWI Electronics Inc

India . 125 parts In-Stock

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Classic Components Corporation

USA . 89 parts In-Stock

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R&J Components

USA . 10 parts In-Stock

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Prism Electronics

USA . 8 parts In-Stock

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Bristol Electronics

USA . 1 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,258 parts In-Stock

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$1.000

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Corphita

USA . 4,922 parts In-Stock

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UNI Independent Distributors

Spain . 3,099 parts In-Stock

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Technical Specifications

RF & Microwave Amplifiers SA5205AD attributes and parameters. Explore more RF & Microwave Amplifiers devices from NXP Semiconductors

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Gain:

17 dB

Mounting Feature:

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Frequency:

600 MHz

Minimum Operating Frequency:

0 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

SOP8,.25

Power Supplies (V):

6

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Amplifiers

Maximum Supply Current:

33 mA

Technology:

Maximum Voltage Standing Wave Ratio:

1.5

Trade Compliance

SA5205AD RF & Microwave trade compliance attributes, and parameters.

NSN

5962-01-374-0042, 5962013740042

NIIN

013740042

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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