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S9S08RN16W2MTG

NXP Semiconductors

S9S08RN16W2MTG by NXP Semiconductors

MICROPROCESSOR; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$4.154

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

S9S08RN16W2MTG by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 96 parts In-Stock

1+ parts

$5.850

100+ parts

$3.190

1k+ parts

$2.630

10k+ parts

$2.490

96

$5.850

$3.190

$2.630

$2.490

Verical

USA . 9,984 parts In-Stock

1+ parts

-

100+ parts

$2.457

1k+ parts

-

10k+ parts

-

9,984

-

$2.457

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 207 parts In-Stock

1+ parts

$4.550

100+ parts

-

1k+ parts

-

10k+ parts

-

207

$4.550

-

-

-

Vyrian

USA . 4,104 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,104

-

-

-

-

Anansix

USA . 1,319 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,319

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,119 parts In-Stock

1+ parts

$2.921

100+ parts

-

1k+ parts

-

10k+ parts

-

2,119

$2.921

-

-

-

One Stop Electronics

USA . 92 parts In-Stock

1+ parts

$4.070

100+ parts

-

1k+ parts

-

10k+ parts

-

92

$4.070

-

-

-

Corphita

USA . 1,923 parts In-Stock

1+ parts

$4.311

100+ parts

-

1k+ parts

-

10k+ parts

-

1,923

$4.311

-

-

-

Microchip USA

USA . 1,933 parts In-Stock

1+ parts

$18.825

100+ parts

-

1k+ parts

-

10k+ parts

-

1,933

$18.825

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$24.621

100+ parts

$22.405

1k+ parts

$20.189

10k+ parts

-

5,000

$24.621

$22.405

$20.189

-

QUARKTWIN TECHNOLOGY LTD

USA . 20,635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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20,635

-

-

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UNI Independent Distributors

Spain . 5,858 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,858

-

-

-

-

Technical Specifications

Microprocessors S9S08RN16W2MTG attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

8

No. of Serial I/Os:

1

No. of Terminals:

16

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Words:

2048

Maximum Seated Height:

1.2 mm

Speed:

20 rpm

Maximum Supply Current:

14 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

S9S08RN16W2MTG Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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